Cooling of Electronic Systems
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36

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5

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Published By Springer Netherlands

9789401044769, 9789401110907

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Optimal Geometry of Convection Cooled Electronic Packages

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_14 ◽

1994 ◽

pp. 277-291 ◽

Cited By ~ 2

Author(s):

Adrian Bejan ◽

Sang W. Lee

Keyword(s):

Electronic Packages ◽

Optimal Geometry

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Information Processing and Heat Transfer Engineering

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_35 ◽

1994 ◽

pp. 911-943 ◽

Cited By ~ 6

Author(s):

Wataru Nakayama

Keyword(s):

Heat Transfer ◽

Information Processing

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Network Modelling of Two-Phase Flow in Porous Structures: An Alternative for the Study of Chip Cooling Enhancement

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_31 ◽

1994 ◽

pp. 811-824

Author(s):

A. K. Stubos ◽

N. Kanellopoulos ◽

A. Mitropoulos

Keyword(s):

Two Phase Flow ◽

Phase Flow ◽

Porous Structures ◽

Network Modelling ◽

Two Phase ◽

Chip Cooling ◽

Cooling Enhancement

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Thermal Control for Cryogenically Cooled Computer Systems

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_25 ◽

1994 ◽

pp. 643-676

Author(s):

Robert J. Krane ◽

James C. Andersen ◽

J. Roger Parsons ◽

Avram Bar-Cohen

Keyword(s):

Computer Systems ◽

Thermal Control

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The Cooling of Electronic Components with Flat Plate Heat Sinks

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_19 ◽

1994 ◽

pp. 391-414 ◽

Cited By ~ 1

Author(s):

Robert J. Krane ◽

Iqballudin Ahmed ◽

J. Roger Parsons

Keyword(s):

Flat Plate ◽

Heat Sinks ◽

Electronic Components ◽

Plate Heat

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Cooling of Electronic Systems by Impinging Air Jets

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_17 ◽

1994 ◽

pp. 339-359

Author(s):

M. Can ◽

E. Pulat

Keyword(s):

Electronic Systems ◽

Air Jets

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Cooling of a Microelectronic Sensor by Turbulent Forced Convection

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_11 ◽

1994 ◽

pp. 203-224

Author(s):

D. Poulikakos ◽

A. Wietrzak

Keyword(s):

Forced Convection

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Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_7 ◽

1994 ◽

pp. 145-163 ◽

Cited By ~ 3

Author(s):

R. A. Wirtz ◽

Weiming Chen ◽

Dan Colban

Keyword(s):

Heat Sinks ◽

Electronic Packages

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Cooling Technology for High Performance Computers: IBM Sponsored University Research

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_5 ◽

1994 ◽

pp. 97-122 ◽

Cited By ~ 5

Author(s):

R. C. Chu ◽

R. E. Simons

Keyword(s):

High Performance ◽

University Research ◽

Cooling Technology ◽

High Performance Computers

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Cooling Technology for High Performance Computers: Design Applications

Cooling of Electronic Systems ◽

10.1007/978-94-011-1090-7_4 ◽

1994 ◽

pp. 71-95 ◽

Cited By ~ 8

Author(s):

R. C. Chu ◽

R. E. Simons

Keyword(s):

High Performance ◽

Cooling Technology ◽

High Performance Computers

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