Reliability, Yield, and Stress Burn-In
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Published By Springer US

9780792381075, 9781461556718
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Nonparametric Approach and Its Applications to Burn-in

1998 ◽  
pp. 243-259
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Nonparametric Approach

Nonparametric Reliability Analysis

1998 ◽  
pp. 177-213
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Reliability Analysis

The Dirichlet Process for Reliability Analysis

1998 ◽  
pp. 281-304
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Reliability Analysis ◽  
Dirichlet Process

Nonparametric Bayesian Approach for Optimal Burn-in

1998 ◽  
pp. 261-279
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Bayesian Approach ◽  
Nonparametric Bayesian

Integrating Reliability into Microelectronics Manufacturing

1998 ◽  
pp. 25-44
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim

Burn-in Performance, Cost, and Statistical Analysis

1998 ◽  
pp. 125-175
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Statistical Analysis

Yield and Modeling Yield

1998 ◽  
pp. 65-91
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim

Basic Reliability Concept

1998 ◽  
pp. 45-64
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim

Parametric Approaches To Decide Optimal System Burn-in Time

1998 ◽  
pp. 215-241
Author(s):  
Way Kuo ◽  
Wei-Ting Kary Chien ◽  
Taeho Kim
Keyword(s):  
Optimal System
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