Frontiers in Electronic Testing - Multi-Chip Module Test Strategies
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Published By Springer US

9781461377986, 9781461561071

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Electron Beam Probing—A Solution for MCM Test and Failure Analysis

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_5 ◽

1997 ◽

pp. 55-63

Author(s):

R. Schmid ◽

R. Schmitt ◽

M. Brunner ◽

O. Gessner ◽

M. Sturm ◽

...

Keyword(s):

Electron Beam ◽

Failure Analysis

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A Survey of Test Techniques for MCM Substrates

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_3 ◽

1997 ◽

pp. 27-38 ◽

Cited By ~ 2

Author(s):

Madhavan Swaminathan ◽

Bruce Kim ◽

Abhijit Chatterjee ◽

Y. Zorian

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Fundamentals of MCM Testing and Design-for-Testability

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_1 ◽

1997 ◽

pp. 7-14 ◽

Cited By ~ 2

Author(s):

Yervant Zorian ◽

V. D. Agrawal

Keyword(s):

Design For Testability ◽

Mcm Testing

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Design-for-Test in a Multiple Substrate Multichip Module

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_9 ◽

1997 ◽

pp. 97-108

Author(s):

Joel A. Jorgenson ◽

Russell J. Wagner ◽

Y. Zorian

Keyword(s):

Multichip Module ◽

Design For Test ◽

Multiple Substrate

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Known Good Die

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_2 ◽

1997 ◽

pp. 15-25 ◽

Cited By ~ 1

Author(s):

Larry Gilg ◽

Y. Zorian

Keyword(s):

Known Good Die

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Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_7 ◽

1997 ◽

pp. 77-86 ◽

Cited By ~ 3

Author(s):

Najmi Jarwala ◽

Y. Zorian

Keyword(s):

Ieee 1149.1

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Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_14 ◽

1997 ◽

pp. 151-166

Author(s):

Cynthia F. Murphy ◽

Magdy S. Abadir ◽

Peter A. Sandborn ◽

Y. Zorian

Keyword(s):

Economic Analysis ◽

Multichip Modules ◽

Known Good Die ◽

Test Process

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Simulation Techniques for the Manufacturing Test of MCMs

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_13 ◽

1997 ◽

pp. 137-149

Author(s):

Mick Tegethoff ◽

Tom Chen ◽

Y. Zorian

Keyword(s):

Simulation Techniques ◽

Manufacturing Test

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Multichip Module Diagnosis by Product-Code Signatures

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_12 ◽

1997 ◽

pp. 127-135

Author(s):

P. Nagvajara ◽

J. Lin ◽

P. Nilagupta ◽

C. Wang ◽

Y. Zorian

Keyword(s):

Multichip Module ◽

Product Code

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An Effective Multi-Chip BIST Scheme

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies ◽

10.1007/978-1-4615-6107-1_8 ◽

1997 ◽

pp. 87-95

Author(s):

Yervant Zorian ◽

Hakim Bederr ◽

V. D. Agrawal

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Frontiers in Electronic Testing - Multi-Chip Module Test StrategiesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Electron Beam Probing—A Solution for MCM Test and Failure Analysis

A Survey of Test Techniques for MCM Substrates

Fundamentals of MCM Testing and Design-for-Testability

Design-for-Test in a Multiple Substrate Multichip Module

Known Good Die

Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules

Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die

Simulation Techniques for the Manufacturing Test of MCMs

Multichip Module Diagnosis by Product-Code Signatures

An Effective Multi-Chip BIST Scheme

Frontiers in Electronic Testing - Multi-Chip Module Test Strategies
Latest Publications