2008 12th IEEE Workshop on Signal Propagation on Interconnects
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Published By IEEE

9781424423170

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An Efficient Equivalent Circuit Model for the EMC Analysis of Power/Ground Noise

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558350 ◽

2008 ◽

Author(s):

X. C. Wei ◽

E. P. Li ◽

E. X. Liu

Keyword(s):

Equivalent Circuit ◽

Equivalent Circuit Model ◽

Circuit Model ◽

Ground Noise

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Using Multiple Scales Method to calculate threshold crossing time for the ramp response for high inductance VLSI interconnects

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558391 ◽

2008 ◽

Author(s):

Agnieszka Ligocka ◽

Wojciech Bandurski

Keyword(s):

Multiple Scales ◽

Multiple Scales Method ◽

Vlsi Interconnects ◽

Threshold Crossing ◽

Crossing Time ◽

Ramp Response

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Range Analysis on the Wave Propagation Properties of a Single Wall Carbon Nano Tube

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558355 ◽

2008 ◽

Cited By ~ 4

Author(s):

B. de Vivo ◽

L. Egiziano ◽

P. Lamberti ◽

V. Tucci

Keyword(s):

Wave Propagation ◽

Range Analysis ◽

Single Wall Carbon ◽

Carbon Nano Tube ◽

Propagation Properties

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Broadband Permittivity Extraction from On-Wafer Scattering-Parameter Measurements

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558382 ◽

2008 ◽

Cited By ~ 10

Author(s):

U. Arz ◽

J. Leinhos

Keyword(s):

Scattering Parameter

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Parametric Macromodeling of Time Domain Responses

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558388 ◽

2008 ◽

Cited By ~ 2

Author(s):

D. Deschrijver ◽

T. Dhaene

Keyword(s):

Time Domain

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A Low-Power Differential Transmission Line Interconnect Using Wafer Level Package Technology

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558361 ◽

2008 ◽

Author(s):

Tomoaki Maekawa ◽

Takahiro Ishii ◽

Junki Seita ◽

Hiroyuki Ito ◽

Kenichi Okada ◽

...

Keyword(s):

Low Power ◽

Transmission Line ◽

Wafer Level ◽

Power Differential ◽

Differential Transmission ◽

Wafer Level Package

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Application of negative group delay active circuits to reduce the 50% propagation Delay of RC-line model

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558347 ◽

2008 ◽

Cited By ~ 7

Author(s):

Blaise Ravelo ◽

Andre Perennec ◽

Marc le Roy

Keyword(s):

Group Delay ◽

Propagation Delay ◽

Negative Group ◽

Line Model ◽

Active Circuits ◽

Negative Group Delay

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An Approach to Model Propagation Characteristics of Multimode Graded-Index Waveguides Manufactured by Ion-Exchange Technology

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558332 ◽

2008 ◽

Cited By ~ 1

Author(s):

Thomas Kuhler ◽

Elmar Griese

Keyword(s):

Ion Exchange ◽

Propagation Characteristics ◽

Graded Index

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Effect of Solder Joint Degradation on RF Impedance

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558411 ◽

2008 ◽

Cited By ~ 11

Author(s):

Daeil Kwon ◽

Michael H. Azarian ◽

Michael G. Pecht

Keyword(s):

Solder Joint

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Fast Delay-Less Interconnect Macromodeling And Simulation by Assumption of a Constant Eigenvector Matrix

2008 12th IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2008.4558386 ◽

2008 ◽

Cited By ~ 4

Author(s):

Bjorn Gustavsen

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2008 12th IEEE Workshop on Signal Propagation on InterconnectsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

An Efficient Equivalent Circuit Model for the EMC Analysis of Power/Ground Noise

Using Multiple Scales Method to calculate threshold crossing time for the ramp response for high inductance VLSI interconnects

Range Analysis on the Wave Propagation Properties of a Single Wall Carbon Nano Tube

Broadband Permittivity Extraction from On-Wafer Scattering-Parameter Measurements

Parametric Macromodeling of Time Domain Responses

A Low-Power Differential Transmission Line Interconnect Using Wafer Level Package Technology

Application of negative group delay active circuits to reduce the 50% propagation Delay of RC-line model

An Approach to Model Propagation Characteristics of Multimode Graded-Index Waveguides Manufactured by Ion-Exchange Technology

Effect of Solder Joint Degradation on RF Impedance

Fast Delay-Less Interconnect Macromodeling And Simulation by Assumption of a Constant Eigenvector Matrix

2008 12th IEEE Workshop on Signal Propagation on Interconnects
Latest Publications