2018 International Symposium on Semiconductor Manufacturing (ISSM)
Latest Publications

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9781538662687

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Design of underfill materials for the latest package

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651155 ◽

2018 ◽

Author(s):

Osamu Suzuki ◽

Toshiaki Enomoto ◽

Kiyoshi Kotaka

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Super-multipoint thickness measurement technology using optical macro inspection system

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651139 ◽

2018 ◽

Author(s):

Takayuki Hamada ◽

Kuniharu Nagashima ◽

Naoki Kanda ◽

Nao Sato ◽

Kuniaki Takeda ◽

...

Keyword(s):

Thickness Measurement ◽

Inspection System ◽

Measurement Technology

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Machine Learning Approaches for Process Optimization

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651142 ◽

2018 ◽

Author(s):

Yusuke Suzuki ◽

Shinya Iwashita ◽

Toshiki Sato ◽

Hitoshi Yonemichi ◽

Hironori Moki ◽

...

Keyword(s):

Machine Learning ◽

Process Optimization ◽

Learning Approaches

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Real Time Measurement of Exact Size and Refractive Index of Particles in Liquid by Flow Particle Tracking Method

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651167 ◽

2018 ◽

Author(s):

Takuya Tabuchi ◽

Kazuna Bando ◽

Sota Kondo ◽

Hiroshi Tomita ◽

Eishi Shiobara ◽

...

Keyword(s):

Refractive Index ◽

Real Time ◽

Particle Tracking ◽

Time Measurement ◽

Tracking Method ◽

Particle Tracking Method ◽

Real Time Measurement ◽

Exact Size ◽

Flow Particle

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[Front cover]

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651133 ◽

2018 ◽

Keyword(s):

Front Cover

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Inline scratch defect detection at post CMP step in FinFET device processing

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651184 ◽

2018 ◽

Author(s):

Mohammed Imrul Hossain ◽

Sean Le ◽

Dale R Sheu

Keyword(s):

Defect Detection ◽

Device Processing

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An Accurate Method for Determining Pattern Collapse Occurrence for Nano-Structures

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651156 ◽

2018 ◽

Author(s):

H. Marumoto ◽

M. Nakamori ◽

H. Kawano

Keyword(s):

Accurate Method ◽

Nano Structures

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Optimization of polishing conditions of rectangular substrate

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651173 ◽

2018 ◽

Author(s):

Akira Ozeki ◽

Matsunori Mori

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ISSM 2018 Welcome Message

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651137 ◽

2018 ◽

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Unveil the Black Box for Performance Efficiency of OEE for Semiconductor Wafer Fabrication

2018 International Symposium on Semiconductor Manufacturing (ISSM) ◽

10.1109/issm.2018.8651146 ◽

2018 ◽

Cited By ~ 1

Author(s):

Chih-Min Yu ◽

Chung-Jen Kuo ◽

Chih-Lin Chiu ◽

Wei-Chin Wen ◽

Minghua Zhang

Keyword(s):

Black Box ◽

Wafer Fabrication ◽

Semiconductor Wafer ◽

Semiconductor Wafer Fabrication

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2018 International Symposium on Semiconductor Manufacturing (ISSM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Design of underfill materials for the latest package

Super-multipoint thickness measurement technology using optical macro inspection system

Machine Learning Approaches for Process Optimization

Real Time Measurement of Exact Size and Refractive Index of Particles in Liquid by Flow Particle Tracking Method

[Front cover]

Inline scratch defect detection at post CMP step in FinFET device processing

An Accurate Method for Determining Pattern Collapse Occurrence for Nano-Structures

Optimization of polishing conditions of rectangular substrate

ISSM 2018 Welcome Message

Unveil the Black Box for Performance Efficiency of OEE for Semiconductor Wafer Fabrication

2018 International Symposium on Semiconductor Manufacturing (ISSM)
Latest Publications