Wafer Bonding - Springer Series in MATERIALS SCIENCE
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Published By Springer Berlin Heidelberg

9783642059155, 9783662108277

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Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_7 ◽

2004 ◽

pp. 263-314 ◽

Cited By ~ 3

Author(s):

L. Di Cioccio ◽

E. Jalaguier ◽

F. Letertre

Keyword(s):

Compound Semiconductor ◽

Semiconductor Heterostructures

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Layer Transfer by Bonding and Laser Lift-Off

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_11 ◽

2004 ◽

pp. 377-415 ◽

Cited By ~ 4

Author(s):

T. D. Sands ◽

W. S. Wong ◽

N. W. Cheung

Keyword(s):

Layer Transfer ◽

Lift Off

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High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_10 ◽

2004 ◽

pp. 359-376

Author(s):

E. D. Kyriakis-Bitzaros ◽

G. Halkias

Keyword(s):

Integrated Circuits ◽

High Density ◽

Hybrid Integration ◽

Silicon Integrated Circuits

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Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_9 ◽

2004 ◽

pp. 327-357 ◽

Cited By ~ 1

Author(s):

A. Plößl

Keyword(s):

Light Emitting Diodes ◽

Cavity Surface ◽

High Brightness ◽

Light Emitting ◽

Surface Emitting Lasers ◽

Vertical Cavity Surface ◽

Emitting Lasers ◽

Wafer Direct Bonding ◽

Vertical Cavity

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ELTRAN® Technology Based on Wafer Bonding and Porous Silicon

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_4 ◽

2004 ◽

pp. 107-156

Author(s):

K. Sakaguchi ◽

T. Yonehara

Keyword(s):

Porous Silicon ◽

Wafer Bonding

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Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_14 ◽

2004 ◽

pp. 473-494

Author(s):

J. Bagdahn ◽

M. Petzold

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Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_8 ◽

2004 ◽

pp. 315-326 ◽

Cited By ~ 1

Author(s):

S. Noda

Keyword(s):

Wafer Bonding ◽

Photonic Bandgap ◽

Three Dimensional ◽

Photonic Bandgap Crystals

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Application of Bonded Wafers to the Fabrication of Electronic Devices

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_6 ◽

2004 ◽

pp. 193-261 ◽

Cited By ~ 2

Author(s):

A. W. Nevin

Keyword(s):

Electronic Devices

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Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_1 ◽

2004 ◽

pp. 1-60

Author(s):

J. Haisma

Keyword(s):

Wafer Bonding ◽

State Of The Art ◽

The State ◽

Anodic Bonding ◽

Fusion Bonding ◽

Moving Front

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Basics of Silicon-on-Insulator (SOI) Technology

Wafer Bonding - Springer Series in MATERIALS SCIENCE ◽

10.1007/978-3-662-10827-7_2 ◽

2004 ◽

pp. 61-83

Author(s):

J.-P. Colinge

Keyword(s):

Silicon On Insulator ◽

Soi Technology

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Wafer Bonding - Springer Series in MATERIALS SCIENCELatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer Berlin Heidelberg

Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon

Layer Transfer by Bonding and Laser Lift-Off

High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits

Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers

ELTRAN® Technology Based on Wafer Bonding and Porous Silicon

Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications

Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach

Application of Bonded Wafers to the Fabrication of Electronic Devices

Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

Basics of Silicon-on-Insulator (SOI) Technology

Wafer Bonding - Springer Series in MATERIALS SCIENCE
Latest Publications