Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Latest Publications

TOTAL DOCUMENTS

12
(FIVE YEARS 0)

H-INDEX

1
(FIVE YEARS 0)

Published By Springer US

9781461359425, 9781461522393
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modeling Chip/Package Power Distribution

1995 ◽  
pp. 149-182 ◽  
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot
Keyword(s):  
Power Distribution

Sources of Noise and Methods of Coupling

1995 ◽  
pp. 5-42
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot

Introduction

1995 ◽  
pp. 1-3 ◽  
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot

Substrate Modeling in Heavily-Doped Bulk Processes

1995 ◽  
pp. 125-134 ◽  
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot
Keyword(s):  
Heavily Doped

A Design Example

1995 ◽  
pp. 255-273
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot

Controlling Substrate Coupling in Bulk P- Wafers

1995 ◽  
pp. 217-233
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot
Keyword(s):  
Substrate Coupling

Substrate Resistance Extraction for Large Circuits

1995 ◽  
pp. 135-148
Author(s):  
Nishath K. Verghese ◽  
Timothy J. Schmerbeck ◽  
David J. Allstot
Keyword(s):  
Substrate Resistance
Load More ...
Sign in / Sign up

Export Citation Format

Share Document