Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures
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Published By Springer International Publishing

9783030252007, 9783030252014

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Future Perspectives

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_7 ◽

2019 ◽

pp. 303-304

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Future Perspectives

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Coupled Thermal Stresses in Advanced Smart Materials

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_4 ◽

2019 ◽

pp. 119-170

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Smart Materials ◽

Thermal Stresses

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Basic Problems of Non-Fourier Heat Conduction

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_2 ◽

2019 ◽

pp. 23-63 ◽

Cited By ~ 1

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Heat Conduction ◽

Fourier Heat Conduction

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Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_5 ◽

2019 ◽

pp. 171-242

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Heat Conduction ◽

Advanced Materials ◽

Thermal Fracture ◽

Fourier Heat Conduction

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Advanced Thermal Fracture Analysis Based on Non-Fourier Heat Conduction Models

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_6 ◽

2019 ◽

pp. 243-302

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Heat Conduction ◽

Fracture Analysis ◽

Thermal Fracture ◽

Fourier Heat Conduction

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Multiphysics of Smart Materials and Structures

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_3 ◽

2019 ◽

pp. 65-117

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Smart Materials ◽

Smart Materials And Structures

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Heat Conduction and Moisture Diffusion Theories

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures ◽

10.1007/978-3-030-25201-4_1 ◽

2019 ◽

pp. 1-22

Author(s):

Zengtao Chen ◽

Abdolhamid Akbarzadeh

Keyword(s):

Heat Conduction ◽

Moisture Diffusion

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Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and StructuresLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer International Publishing

Future Perspectives

Coupled Thermal Stresses in Advanced Smart Materials

Basic Problems of Non-Fourier Heat Conduction

Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction

Advanced Thermal Fracture Analysis Based on Non-Fourier Heat Conduction Models

Multiphysics of Smart Materials and Structures

Heat Conduction and Moisture Diffusion Theories

Structural Integrity - Advanced Thermal Stress Analysis of Smart Materials and Structures
Latest Publications