Epoxy–thiol–imidazole system is promising for microelectronic packaging areas, such as underfills and low-temperature fast curing adhesives, but there is little knowledge on the corrosion resistance of this system. In this article, the anticorrosion and thermal and mechanical properties were characterized by theoretical and experimental methods and were understood from a fundamental perspective of structure. The cure behaviors were evaluated by differential scanning calorimeter. The mechanical and thermal properties were characterized by dynamic mechanical, thermomechanical, and thermos-gravimetric methods. The water absorption process was monitored using gravimetric measurement. Results show that among compositions of variable thiol–epoxy molar ratios, the one with ratio 0.25 has the best anticorrosion property and improved mechanical property, as well as good water resistance at room temperature. Both the average tensile strength and modulus increased initially and then declined with the addition of thiol part, while the average peel strength increased to above thrice the value of that of neat epoxy–imidazole system for thiol–epoxy 1:1 system.
Equilibria in cobalt(II)–amino acid–imidazole system under oxygen-free conditions: effect of side groups on mixed-ligand systems with selected L-α-amino acids