Capacitance study of integrated circuits matrix interconnects

<span>Propagation delays and couplings between nearby lines affect the circuit performances (speed, power consumption) and operations. Propagation delays in longer lines can become critical compared to the clock frequency and can induce unwanted signals in neighboring lines ("crosstalk" phenomenon). Induced line capacitances can induce parasitic signals. Hence characterizing of these capacitances is of paramount importance. The present work deals with the analysis of capacitance of a multilayer conductor interconnect aiming for their possible exact extraction. We used three topologies of a microstrip conductor interconnects and identified the potential distributor and then computed the capacitance and inductance matrix using a finite element method. The first analysis dealt with parallel microstrip conductors and the second with two levels (plan) of a microstrip conductors the results are compared to those obtained by other methods and found quite encouraging.</span>

A planar microwave phase shifter using microstrip–CPW–microstrip transition with defected ground structures

A novel planar printed phase shifter design is proposed in this paper. The design is developed with microstrip–conductor-backed coplanar waveguide– microstrip (MP–CBCPW–MP) transition line with different defected ground structures (DGS). The differential phase shift can be controlled by altering the DGS dimensions. Three prototypes with DGS dimensions 5 × 10, 10 × 20, and 10 × 30 mm2, are employed at the finite ground plane to achieve 5°, 20°, and 30° shift in phase respectively and are validated with the phase delay relation. The prominent effect of the transition region is to confine the field area. The resonance is at 700 MHz with a bandwidth of 400 MHz (0.4–0.8 GHz). The proposed phase shifter can be used for broadcasting applications. The proposed MP–CBCPW–MP transition phase shifter design with DGS is simulated, fabricated, and measured to analyze its performance.

Effect of Interfacial Characteristics of Metal Clad Polymeric Substrates on Electrical High Frequency Interconnection Performance

Etched metallic conductor lines on metal clad polymeric substrates are used for electronic component interconnections. Significant signal losses are observed for microstrip conductor lines used for interconnecting high Frequency (above 20 GHz) devices. At these frequencies, the electronic signal travels closer to the metal-polymer interface due to the skin effect. Copper-teflon interfaces were characterized by SEM and AES to determine the interfacial properties. Data relating roughness of the copper film to signal losses was compared to theory. Films used to enhance adhesion, were also found, to a lesser extent, to contribute to these losses.