Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

Electrodeposition of Cu-Ag films from acidic sulfate bath was conducted at n-Si(001) and polycrystalline Ru substrates. Significant nucleation overpotential of 0.4 V is observed with the Cu-Ag bath at n-Si(001) substrate, whereas the electrodeposition of Cu-Ag at Ru substrate is influenced by Ru oxides at the surface. Incomplete coverage of Si substrate by Cu-Ag deposit was observed from the deposition systems without Ag(I), or with 0.1 mM Ag(I), comparing with the compact Cu-Ag film obtained with the deposition bath containing 0.01 mM Ag(I). Layered and faceted Cu-Ag deposit was observed at small Cu deposition overpotential with the Ru substrate. Phase composition of the Cu-Ag deposits at n-Si(001) substrate from electrolyte with various Ag(I) concentrations is examined by XRD. Limited solubility of Ag (0.4 at.%) was observed in fcc-Cu until phase separation occurs. The classical model for nucleation kinetics in electrodeposition was used to examine the potentiostatic transients of the Cu-Ag electrodeposition at n-Si(001) substrate.

ELECTROCHEMICAL DEPOSITION OF MAGNESIUM IN ETHEREAL GRIGNARD SALT SOLUTION WITH IONIC LIQUID ADDITIVE

The electrochemical deposition of magnesium was investigated in ethereal Grignard salt solution with tetraethylammonium bistrifluoro-methanesulfonimidate additive, using cyclic voltammetry, potentiostatic transients, and scanning electron microscope measurements. The voltammograms showed the presence of reduction and oxidation peaks associated with the deposition and dissolution of magnesium. From the analysis of the experimental current transients, it was shown that the magnesium deposition process was characterized as a three-dimensional nucleation. The deposited product obtained from potentiostatic reduction presented a generally uniform and dense film.

Effect of temperature on cyclic voltammograms during the electrodeposition of lead

The electrochemical behavior of lead deposition process in a temperature range between 25 and 75 °C was studied in a medium of lead chloride and ammonium acetate by linear and cyclic sweep perturbation. The study was undertaken on four substrates: Pb, Cu, Ag, and C. An increase in temperature resulted in accelerating the deposition process and promoted dendrite formation. Moreover, different kinetic parameters such as adsorption isotherms, Tafel slopes, and diffusion coefficient were affected as a function of temperature elevation. Surface analytical study performed by Auger electron spectroscopy revealed an increase in peak intensities of Cl and Pb as the temperature increased. Keywords: electrodeposition, cyclic voltammetry, potentiostatic transients, underpotential deposition, temperature effect.