moving interfacial crack
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The influence of electrostatic force on the moving interfacial crack between dissimilar piezoelectric materials

2017 Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA) ◽

10.1109/spawda.2017.8340345 ◽

2017 ◽

Author(s):

Lu-qiao Qi ◽

Yan Shi ◽

Cun-fa Gao

Keyword(s):

Piezoelectric Materials ◽

Electrostatic Force ◽

Interfacial Crack ◽

Moving Interfacial Crack

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A mode III moving interfacial crack based on strip magneto-electric polarization saturation model

Smart Materials and Structures ◽

10.1088/0964-1726/24/8/085015 ◽

2015 ◽

Vol 24 (8) ◽

pp. 085015 ◽

Cited By ~ 2

Author(s):

Xiaodong Xia ◽

Zheng Zhong

Keyword(s):

Interfacial Crack ◽

Electric Polarization ◽

Saturation Model ◽

Mode Iii ◽

Polarization Saturation ◽

Polarization Saturation Model ◽

Moving Interfacial Crack

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Layered soft ferromagnetic materials with moving interfacial crack in uniform magnetic field

International Journal of Applied Electromagnetics and Mechanics ◽

10.3233/jae-2007-899 ◽

2007 ◽

Vol 26 (1-2) ◽

pp. 69-85

Author(s):

She-Xu Zhao ◽

Kang Yong Lee

Keyword(s):

Magnetic Field ◽

Uniform Magnetic Field ◽

Interfacial Crack ◽

Ferromagnetic Materials ◽

Soft Ferromagnetic ◽

Moving Interfacial Crack

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Moving interfacial crack between two dissimilar soft ferromagnetic materials in uniform magnetic field

Journal of Mechanical Science and Technology ◽

10.1007/bf02916352 ◽

2007 ◽

Vol 21 (5) ◽

pp. 745-754

Author(s):

She-Xu Zhao ◽

Kang Yong Lee

Keyword(s):

Magnetic Field ◽

Uniform Magnetic Field ◽

Interfacial Crack ◽

Ferromagnetic Materials ◽

Soft Ferromagnetic ◽

Moving Interfacial Crack

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Moving interfacial crack between piezoelectric ceramic and elastic layers

European Journal of Mechanics - A/Solids ◽

10.1016/s0997-7538(00)01121-9 ◽

2000 ◽

Vol 19 (6) ◽

pp. 979-987 ◽

Cited By ~ 17

Author(s):

Jong Ho Kwon ◽

Kang Yong Lee

Keyword(s):

Piezoelectric Ceramic ◽

Interfacial Crack ◽

Elastic Layers ◽

Moving Interfacial Crack

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Stress intensity factors for moving interfacial crack between bonded dissimilar fixed orthotropic layers

Computers & Structures ◽

10.1016/s0045-7949(98)00111-4 ◽

1998 ◽

Vol 69 (4) ◽

pp. 459-472 ◽

Cited By ~ 15

Author(s):

S. Das ◽

B. Patra

Keyword(s):

Stress Intensity ◽

Stress Intensity Factors ◽

Interfacial Crack ◽

Intensity Factors ◽

Moving Interfacial Crack

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