Wetting Behavior of LBE on Corroded Candidate LFR Structural Materials of 316L, T91 and CLAM

In this work, the wetting behaviors of lead-bismuth eutectic (LBE) on corroded 316L, T91, and CLAM surfaces were studied. The wettability of LBE on virgin and corroded surfaces were tested at 450 °C by using the sessile-drop (SD) method after immersing the samples in LBE with saturated oxygen concentration for 400, 800, and 1200 h at 450°C. Additionally, the morphology, as well as element distribution of the corrosion structure, were characterized by scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS). The results showed that the virgin samples of three materials are non-wetting to LBE, and the formation of corrosion structures further reduces the wettability. Besides, the thickness of the corrosion layer formed on the 316L surface grew more slowly than the other two steel, which results in better corrosion resistance of austenitic steel 316L than that of ferritic/martensitic steels T91 and CLAM at 450 °C. Meanwhile, the morphology and distribution of corrosion products are important factors affecting the wettability of the steel surface. The formation of corrosion products with high roughness as well as disorder results in a significant reduction in surface wettability.

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Wetting characteristics of polymer adhesives with different chain bending stiffness

Polymer adhesives are widely used in daily applications and in industry owing to their flexibility and overall non-toxicity, particularly in interfacial adhesion. The spreading of polymer adhesives on adherend is one of the essential considerations for the interfacial adhesion of polymer adhesives, which is strongly related to their wetting behaviors. While relationships between polymer microstructure and adhesion have been investigated in previous studies, it remains challenging to unveil the effect of polymer microstructure on wettability. To address this issue, here we utilize coarse-grained molecular dynamics (CGMD) simulations to systematically elucidate how the wettability of a polymer adhesive droplet on a surface depends on bending stiffness. The wetting dynamics and the contact angle are studied to show the evolution of morphology of droplets during the wetting process. The results indicate the wettability is weakened by the increase of bending stiffness of polymer chain. Detailed thermodynamic property analysis is further conducted, revealing that the adhesion between the polymer droplet and substrate deteriorates due to the decline of wettability. Interestingly, we observe such deterioration becomes more significant by both increasing the temperature and decreasing the bending stiffness. Our study sheds light on the dependence of chain bending stiffness and temperature on the wetting behavior of polymer adhesive droplets, and offers insights, which, upon experimental validation can then be used for the design of adhesives or hydrogels.

Evaporation of Sessile Droplets of Polyelectrolyte/Surfactant Mixtures on Silicon Wafers

The wetting and evaporation behavior of droplets of aqueous solutions of mixtures of poly(diallyldimethylammonium chloride) solution, PDADMAC, with two different anionic surfactants, sodium laureth sulfate, SLES, and sodium N-lauroyl N-methyl taurate, SLMT, were studied in terms of the changes of the contact angle θ and contact length L of sessile droplets of the mixtures on silicon wafers at a temperature of 25 °C and different relative humidities in the range of 30–90%. The advancing contact angle θa was found to depend on the surfactant concentration, independent of the relative humidity, with the mixtures containing SLES presenting improved wetting behaviors. Furthermore, a constant droplet contact angle was not observed during evaporation due to pinning of the droplet at the coffee-ring that was formed. The kinetics for the first evaporation stage of the mixture were independent of the relative humidity, with the evaporation behavior being well described in terms of the universal law for evaporation.