sn orientation
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Effect of Sn orientation on Cu diffusion for Pb-free solders under a temperature gradient

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.1109/icep-iaac.2015.7111064 ◽

2015 ◽

Author(s):

Fan-Yi Ouyang ◽

Wei-Neng Hsu ◽

Yi-Shan Yang

Keyword(s):

Temperature Gradient ◽

Sn Orientation

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Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2014.11.222 ◽

2015 ◽

Vol 627 ◽

pp. 281-286 ◽

Cited By ~ 34

Author(s):

T.L. Yang ◽

J.J. Yu ◽

C.C. Li ◽

Y.F. Lin ◽

C.R. Kao

Keyword(s):

Solder Joints ◽

Sn Orientation

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The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration

Journal of Electronic Materials ◽

10.1007/s11664-013-2789-3 ◽

2013 ◽

Vol 43 (1) ◽

pp. 43-51 ◽

Cited By ~ 9

Author(s):

Xioranny Linares ◽

Chris Kinney ◽

Kyu-Oh Lee ◽

J. W. Morris

Keyword(s):

Intermetallic Compound ◽

Diffraction Study ◽

Electron Backscatter Diffraction ◽

Electron Backscatter ◽

Sn Orientation ◽

Backscatter Diffraction

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The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects

Journal of Electronic Materials ◽

10.1007/s11664-012-2306-0 ◽

2013 ◽

Vol 42 (4) ◽

pp. 607-615 ◽

Cited By ~ 19

Author(s):

Chris Kinney ◽

Xioranny Linares ◽

Kyu-Oh Lee ◽

J.W. Morris

Keyword(s):

Intermetallic Compound ◽

Intermetallic Compound Growth ◽

Sn Orientation

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