cure epoxy resin
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Author(s):  
Alex Reichanadter ◽  
Dave Bank ◽  
Jan‐Anders E. Mansson

2019 ◽  
pp. 39-42
Author(s):  
D. I. Kogan ◽  
L. V. Chursova ◽  
N. N. Panina ◽  
T. A. Grebeneva ◽  
E. I. Golikov ◽  
...  

The paper deals with aspects of creating a single-component, fast-curing binder ACM 1216, capable of forming a matrix at low temperatures with a short curing period, having high enough strength and performance characteristics.The prospects for the development of polymeric composite materials based of quick cure binder for manufacture of sports industry products are presented.


1993 ◽  
Vol 5 (2) ◽  
pp. 145-153 ◽  
Author(s):  
Hasmukh S Patel ◽  
Vipul J Shah

The Michael addition reaction of N,N'-l,4-phenylene bis(maleimide) (PBM) with 4,4'-diamino diphenyl methane (DDM) at 1:1, 1: 1.5 and 1:2 molar ratios was carried out in melt at 125-130'C. The resultant polyimide oligomers (PBM-DDM) were characterized by elemental analysis, number of amino and imino groups, IR spectral studies, number average molecular weight, by non-aqueous conductometric titration, and thermogravimetry. These polyimide oligomers were used to cure epoxy resin, namely diglycidyl ether of bisphenol-A, and studied by differential scanning calorimetry (DSC). The unreinforced PBM-DDM epoxy-cured products have also been prepared and characterized. A preliminary study of glass reinforcement based on the PBM-DDM epoxy system has also been established.


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