Mechanism of Dy3+ and Nd3+ Ions Electrochemical Coreduction with Ni2+, Co2+, and Fe3+ Ions in Chloride Melts

The present paper is devoted to the study of the processes of the mechanism of electrochemical coreduction of Dy3+ and Nd3+ ions with Ni2+, Co2+, and Fe3+ ions in the equimolar NaCl-KCl melt at 973 K and characterization of the synthesized samples. The performed voltammetry analysis of the electrochemical coreduction processes elucidated a significant difference in the values of the extraction potentials of the studied metals. This melt testifies that intermetallic compounds of Dy and Nd with Ni, Co, and Fe may be synthesized in the kinetic regime. The intermetallic phases of Dy and Nd with Ni, Co, and Fe are found to be formed along with the phases of metallic Ni, Co, and Fe either during electrolysis at the cathode current densities exceeding the limiting diffusion current of Ni2+, Co2+, and Fe3+ ions or in the potentiostatic regime at the potentials of the corresponding voltammetry curves. Therefore, the following interrelated key parameters affecting the electrochemical synthesis of Dy and Nd intermetallic compounds with Ni, Co, and Fe were determined: (i) composition of the electrolyte, i.e., concentrations of FeCl3, CoCl2, NiCl2, DyCl3, and NdCl3; (ii) cathode current density or electrolysis potential and (iii) electrolysis time. The obtained samples were characterized by micro-X-ray diffraction analysis, cyclic voltammetry, and scanning electron microscopy methods.

Relationship between Charge Transfer Diffusion Coefficients and Doping Level for electro generated thin PEDOT films on ITO

Thin films of poly-3,4-ethylene dioxythiophene (PEDOT) were electrodeposited on transparent electrodes of indium tin oxide (ITO) using potentiostatic regime. These films had thicknesses ranging from 15 nm to 60 nm and were studied using UV-vis absorption and chronoamperometric techniques in monomer-free tetrabutylammonium perchlorate/acetonitrile solutions. The charge transfer diffusion coefficient (D) of the films were calculated using Cottrell model for a wide range of potential steps from −1.60 to 1.60 V vs. Ag°/AgNO3. For p-doped films, the highest diffusion coefficients were obtained when a potential of 0.70 V was applied. Moreover, a direct relationship between film thickness and their diffusion coefficients was found for thin PEDOT films showing D values up to 1.4 × 10−9 cm2 s−1 for 60 nm thickness films. These values are remarkably higher than the D of 1.8 × 10−11 cm2 s−1 obtained for spin-coated PEDOT: PSS films of similar thickness.

Overpotential controls a morphology of electrolytically produced copper dendritic forms

The morphologies of copper dendritic forms obtained in both potentiostatic and galvanostatic regimes of electrolysis with various amounts of the electricity were analyzed by the scanning electron microscopy (SEM) technique. Irrespective of amount of passed electricity, 3D (three dimensional) pine-like dendrites with sharp tips were formed in the potentiostatic regime of electrolysis. On the other hand, the amount of passed electricity had a strong effect on the shape of the 3D pine-like dendrites formed in the galvanostatic regime of electrolysis. Dendrites with sharp tips were formed with smaller amount of passed electricity, while dendrites with globular tips were formed with larger amounts. The change in the shape of the galvanostatically synthesized 3D pine-like dendrites was explained by comparison with copper deposits obtained potentiostatically at overpotentials that corresponded to the final overpotentials during galvanostatic regime of electrolysis for the analyzed amounts of electricity. Based on the similarity of the obtained morphologies at the macro level, it was concluded that the overpotential plays a crucial role in the formation of the electrolytically synthesized dendrites and that the controlled conditions of electrolysis could represent a suitable way for a synthesis of spherical Cu particles by electrolysis.

Electrodeposition of thin metallic layer for solar cell electrodes

Purpose – The paper aims to show application of the electrochemically deposited coatings for thickening of the screen printed electric paths potentially applied in photovoltaic cells. Design/methodology/approach – The electric paths were screen printed with the use of silver-based paste. The paths were thickened by electrodeposition of thin copper layer in potentiostatic regime from surfactant-free plating bath. The morphology and surface quality of the paths were studied by imaging with scanning electron microscopy. Findings – The electric paths can be thickened successfully, but quality for the screen printed substrate determines quality of deposited layer. The EDX analysis confirmed that the deposited copper layer covered uniformly the printed paths. Research limitations/implications – The adhesion of the copper-covered path to the silicon wafer surface depends on adhesion of the original screen printed path. Originality/value – This paper confirms that electrodeposited copper can be applied for screen printed silver paths thickening in a controllable way.

Effects of Voltage on the Characteristics and Corrosion Resistance of Microarc Oxidation Coatings on Ti6Al4V Alloy

Ceramic coatings were prepared on Ti6Al4V in aluminate-based electrolyte by microarc oxidation at various voltages using potentiostatic regime. The phase composition, microstructure and morphology of the coatings were characterized by eddy thickness gauge, XRD and SEM respectively. The corrosion resistance of the coatings was investigated by polarization curve and electrochemical impedance spectroscopy (EIS) in 3.5% NaCl aqueous solution. The results show that all the coatings are mainly composed of Al2TiO5. When the voltage increases from 360V to 510V, the coating thickness grows significantly, and the pores in the coatings get large and deep simultaneously. As a result, the corrosion resistance of the coatings increases first and then decreases with the turning point of 410V, at which the coating prepared shows the smallest corrosion current density of 1.965E-9 A/cm2. The coating prepared at a higher voltage before the discharges grow large and intense (410V in this work) shows the best corrosion resistance.