Research on Key Technology of Tile T/R Module Design

Tile T/R module has the characteristics of miniaturization, lightweight, high integration and high performance, which are very difficult to develop. This paper studies the key technologies involved in the development of T/R module, and focuses on the key technologies such as high integrated multifunction chip technology, high performance Radio Frequency (RF) 3D interconnection technology, high integrated multichannel RF design technology and thermal design technology. Through research and analysis, a design scheme of tile T/R module with miniaturization, high performance and high reliability is proposed.

Design of Double Barrier Ceramic Radio Frequency Vacuum Window

Vacuum windows are an essential part of any radio frequency (RF) system which launches/couples RF power from an atmospheric to a vacuum environment. This paper describes the RF design of a double barrier ceramic coaxial vacuum window. Alumina 99.5% pure is considered as ceramic barrier material while inner and outer conductors are oxygen-free copper. As the initial design approach the thickness, slope, depth of ceramic in the conductor is varied and the performance of the window is studied. The design is optimised to achieve the best insertion loss, return loss response for operating frequency range up to 65MHz.

Construction Kit of RF-Blocks in Package Technologies

Advanced packages are necessary to cope with the requirements of 5G and radar technologies with 60 GHz and beyond. For proper RF design with rising package technology requirements demands for usage of predefined structures with predefined layout elements, manufactured and measured elements. This paper deals with an approach to have such elements available to build advanced types of packages in shorter time compared to classical approaches. The approach is a general approach but it is demonstrated with an advanced two-level package-on-package technology with a leading edge IC technology. It is also used explain the build-up of a construction kit of RF-blocks from the design phase of test structures up to measurement of such structures, qualification and model building. From the test structure more general structures can be derived and used in the design of future 5G applications. This enables better time-to-market, reduces cost and provides higher design validation in terms of first time right.