The thermodynamical analysis algorithm at sapphire-metal soldering design in plasma electronics devices

This project is devoted to the design of algorithm of the possibility analysis of phys-ical-chemical reaction course at sapphire-metal soldering, based on the known equations of thermodynamics. There are stated the results of the thermodynamical analysis of the general methods of sapphire compounds obtaining with usage of molybdenum and wolfram metallization, and active soldering with titanium

Direct Active Soldering of PEO Coated and Uncoated AA6061 Aluminium Alloy

Active soldering is an emerging technology of joining a range of materials, which utilizes Sn-Ag composition solder alloy other than conventional Sn-Pb solder, along with reactive element additions (like Ti, Ta, Hf and Zr). In the present study, active soldering is employed for bonding AA6061 aluminium alloy using S Bond 220-50 and S Bond 220M active solders. Soldering was achieved by direct active soldering of AA6061 plates each other using S Bond 220-50 and PEO coated AA6061 aluminium alloy using S Bond 220M, taking into consideration of the application of active solder alloy in joining ceramics. Mechanical properties were evaluated using hardness and lap shear test. Microstructure analysis is carried out by SEM microscopy. The soldered area is examined using EDS giving fair idea regarding the composition of elements present in the solder. It is observed that direct bonding of aluminium alloy using S Bond 220-50 showed better bond strength and hardness when compared with joining using S Bond 220M of the PEO coated aluminium plate.