Effect of Strain Amounts on Cold Compression Deformation Mechanism of Ti-55531 Alloy with Bimodal Microstructure

The plastic deformation mechanism of Ti-55531 alloy with bimodal microstructure was investigated by compression testing at room temperature. The bimodal microstructure was composed of equiaxed primary α phase (αp) and transformed β (βtrans) that consisted of acicular secondary α phase (αs) and residual β phase (βr). In the initial stage of deformation, the αp grains first underwent plastic deformation, the dislocations germinated and increased, forming the dislocation loop with the dislocation free zone in αp at the true stain of 0.083. With the true strain subsequently increasing to 0.105, the dislocation tangle and dislocation pile-up occurred in αp, and a lot of dislocations were also activated in most of αs. Moreover, the dislocation density was increasing gradually in βr with the adding of strain. Finally, the dislocation pile-up and dislocation tangle appeared in αs and βr at the true strain of 0.163. The whole deformation process was coordinated by αp, αs and βr. They accommodated mutually and completed deformation together.

Microstructural Evolution in Pure Copper Severely Deformed by the ARB Process

An oxygen free high conductivity (OFHC) copper (99.99%) was intensely deformed by the accumulative roll-bonding (ARB) process up to equivalent strain of 4.8 at ambient temperature. The microstructure evolution during the ARB process was explained by grain subdivision. The deformed specimens revealed dislocation cell structures at low strain and elongated ultra fine grains separated by high angle boundaries at high strain. The spacing of the high angle lamellar boundary exponentially decreased as a function of strain. The fractions of high angle boundaries (HAB) and the low angle boundaries (LAB) were nearly equal even at strain of 3.2, which was significantly different from the ARB processed Al alloys and ferritic steel where the HAB fraction was above 70% at the same strain. TEM observations indicated a mixed microstructure of dislocation boundaries and cell walls with dislocation tangle at low strain of 1.6, and small recrystallized grains partly appeared above strain of 3.2. As a result, the LAB fraction due to partial recrystallization was high even at strain of 4.8. The occurrence of recrystallization is attributed to high purity of the OFHC copper, the accumulated dislocation density, and the adiabatic heating during the ARB process of one-pass large reduction without lubrication.

In-Situ TEM Deformation Studies of Dislocation Generation and Motion in High-Purity MO Single Crystals

The generation and motion of dislocations in high-purity single crystals of Mo have been observed in real time by deforming electron-transparent samples in-situ in a transmission electron microscope. At 300 K and at low levels of stress, a novel dislocation source was observed that generated a long, straight screw dislocation. The source was a dislocation tangle that existed in the annealed material. An edge dislocation emerged from the tangle, trailing behind it the screw dislocation. These screw dislocations were immobile at this stress level. At higher stresses, the same dislocation tangle generated many dislocations, but now by a pole mechanism. The nature of these tangles and the source operation mechanisms will be described.