Effect of Heat Treatment on Dendritic Microsegregation of an Al-Cu-Si Alloy

Solidification experiment a graphite mold was carried out on ternary alloy Al-4.61Cu-0.92Si and typical dendrite microstructure was obtained. The influence of heat treatment on microsegregation between the dendrite, and the amount and morphology of the non-equilibrium eutectic phases were studied. Line scans results shows that the dendrite microsegregation disappeared after heat treatment under temperature near the ternary eutectic point. And the amount of eutectic phases is decreased obviously and the morphology of most θ-phase is changed from normal pattern to sphere or nearly spherical.

Solidification Path Calculations of Al-Cu-Si Alloys in Al-Rich Corner

The solidification path of Al-Cu-Si alloys in the Al-rich corner are investigated. The thermodynamic data needed in the calculation are obtained by direct coupling with the CALPHAD software Thermo-Calc. A paralell experimental investigation is conducted to validate the prediction results. The calculated results show that, the sensitivity of the variations in the solidification paths to the cooling rates are depended on the distance of the initial compositions from the binary eutectic troughs or the ternary eutectic point. Reasonable agreements are observed between the predicted amounts of θ-phase and the measured results.

Phase relations near ternary eutectic point in the Ag-In-Sb system

The results of the phase relations near ternary eutectic point in the Ag-In-Sb system are investigated in this paper. Phase equilibrium calculation was done using Thermocalc software and experimental DTA results for the chosen alloys in the isopleths with molar ration of In:Sb = 7:3; 9:1 and 1:1. The structural characteristics of these alloys have been investigated using light optic microscopy and scanning electron microscopy, while hardness measurements have also been done. Solidification path for three ternary alloys located on three different investigated isopleths was calculated using Pandat software.