Porosities and Fatigue Property of Two A356 Cast Aluminum Alloy

To investigate the fatigue property of A356 cast aluminum alloy, the pore size distribution in two kinds of A356 alloy were statistically tested, and the S-N curves were plotted by conducting four-point bend fatigue test, then the fractography of the fatigue specimens were examined under scan electron microscope (SEM). It was indicated that the fatigue strength of the A356.2 alloy contenting more large pores and rougher crystalline grain was lower than that of A356.1 alloy, though the yield strength of A356.2 alloy was higher. Most of the fatigue cracks initiated from the pores that located on or close to the surface of the specimens, and the fracture of the specimens were induced from the growth of multi-sites initiated fatigue crack.

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study, very-thin quad flat no-lead (VQFN) assembly with Sn–Ag–Cu lead-free solder was tested under three-point and four-point cyclic bending loads at both room temperature (25°C) and high temperature (125°C). The correlation between three-point and four-point bend tests was developed. Two different board surface finishes of electroless Ni and immersion gold (ENIG) and organic solderability preservatives (OSP) were investigated. Bending fatigue resistance of VQFN with OSP finish is slightly better than ENIG finish case. The acceleration factor of failure at high temperature (125°C) is higher than that at room temperature (25°C). Finite element analysis modeling and simulation were performed for different test conditions to investigate the solder joint stress-strain behavior. Volume-averaged energy density was used as a fatigue damage parameter and energy-based bending fatigue models were developed for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C.