joint bonding
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Internal Joint Bonding of Prestressed Concrete Cylinder Pipe: The Improbable Project

Pipelines 2020 ◽

10.1061/9780784483213.029 ◽

2020 ◽

Author(s):

Greg Smith

Keyword(s):

Prestressed Concrete ◽

Concrete Cylinder ◽

Internal Joint ◽

Prestressed Concrete Cylinder Pipe ◽

Joint Bonding

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Butt-joint bonding of timber as a key technology for point-supported, biaxial load bearing flat slabs made of cross-laminated timber

IOP Conference Series Earth and Environmental Science ◽

10.1088/1755-1315/323/1/012144 ◽

2019 ◽

Vol 323 ◽

pp. 012144

Author(s):

S Zoellig ◽

M Muster ◽

A Themessl

Keyword(s):

Butt Joint ◽

Load Bearing ◽

Key Technology ◽

Cross Laminated Timber ◽

Flat Slabs ◽

Biaxial Load ◽

Joint Bonding

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Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374669 ◽

2018 ◽

Cited By ~ 1

Author(s):

Zheng Zhang ◽

Chuantong Chen ◽

Hao Zhang ◽

Shijo Nagao ◽

Katsuaki Suganuma

Keyword(s):

Low Temperature ◽

Copper Substrate ◽

Bonding Technology ◽

Bare Copper ◽

Joint Bonding

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Milicia excelsa (Welw.) C. C. Berg sawdust as glue-extender in urea formaldehyde-adhesive in enhancing Ceiba pentandra (L.) Gaertn. veneer joint bonding strength

Journal of the Indian Academy of Wood Science ◽

10.1007/s13196-017-0188-8 ◽

2017 ◽

Vol 14 (1) ◽

pp. 60-69

Author(s):

C. Antwi-Boasiako ◽

S. Abam

Keyword(s):

Bonding Strength ◽

Urea Formaldehyde ◽

Ceiba Pentandra ◽

Milicia Excelsa ◽

Joint Bonding

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Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

Microelectronic Engineering ◽

10.1016/j.mee.2011.06.001 ◽

2011 ◽

Vol 88 (11) ◽

pp. 3244-3248 ◽

Cited By ~ 1

Author(s):

Rong Cheng ◽

Kewei Jiang ◽

Xinxin Li

Keyword(s):

Solder Joint ◽

Electronic Packaging ◽

Bonding Strength ◽

Joint Bonding

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Use of Functionalized Nanosilica to Improve Thermo-Mechanical Properties of Epoxy Adhesive Joint Bonding Aluminium Substrates

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2010.1458 ◽

2010 ◽

Vol 10 (4) ◽

pp. 2844-2849 ◽

Cited By ~ 7

Author(s):

C. Sperandio ◽

A. Laachachi ◽

D. Ruch ◽

C. Poilâne ◽

P. Bourson ◽

...

Keyword(s):

Mechanical Properties ◽

Adhesive Joint ◽

Epoxy Adhesive ◽

Joint Bonding

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