hard gold
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2018 ◽  
Vol 18 (3) ◽  
pp. 2104-2108
Author(s):  
Young-Min Byoun ◽  
Young-Tai Noh ◽  
Young-Geun Kim ◽  
Seung-Hwan Ma ◽  
Gwan-Hoon Kim
Keyword(s):  

Synlett ◽  
2016 ◽  
Vol 27 (13) ◽  
pp. 1936-1940 ◽  
Author(s):  
Nobuyoshi Morita ◽  
Osamu Tamura ◽  
Yuta Saito ◽  
Ayumi Muraji ◽  
Shintaro Ban ◽  
...  
Keyword(s):  

2012 ◽  
Vol 187 ◽  
pp. 267-271
Author(s):  
Xiao Gang Liu ◽  
Ping Liu ◽  
Xiao Long Gu ◽  
Xin Bing Zhao

Au plating was widely used to the function of soldering, contact/connection, and decoration, rendered by the extremely good solderability, customer favorite noblest appearance, excellent corrosion resistance, high electrical conductivity, etc. while Au plating thickness and quality are critical to influence the function performance and reliability after service in field. In this paper, soft gold, hard gold and selective gold plating processes were introduced in different application aspects. Some typical failure analysis cases related to Au plating such as passives tombstone, contact philosophy and mercury attack were exemplified to make clear the correct application and proper Au thickness requirement. The prevention solutions were also recommended.


2011 ◽  
Vol 109 (5) ◽  
pp. 19-23
Author(s):  
Olaf Kurtz ◽  
Jurgen Barthelmes ◽  
Robert Ruther ◽  
Michael Danker ◽  
Florence Lagorce-Broc ◽  
...  
Keyword(s):  

2011 ◽  
Vol 56 (5) ◽  
pp. 2546-2551 ◽  
Author(s):  
Zhengwei Liu ◽  
Min Zheng ◽  
Robert D. Hilty ◽  
Alan C. West
Keyword(s):  

2010 ◽  
Vol 157 (7) ◽  
pp. D411 ◽  
Author(s):  
Zhengwei Liu ◽  
Min Zheng ◽  
Robert D. Hilty ◽  
Alan C. West
Keyword(s):  

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