A New Real-Time Process Monitor Method Based on MRC

In order to ensure safe and stable running of applications, this paper analyses the limitation of traditional process-monitoring methods, and then designs a new real-time process monitor method based on Mandatory Running Control (MRC) technology. This method not only can monitor the processes, but also can control them from system kernel level to improve the reliability and safety of applications, so as to ensure the security and stability of information system.

Application of a Fast Calculation Model for the Process Monitoring of Open Die Forging Processes

To provide a high quality of forged products, a homogeneous distribution of material properties has to be achieved inside the ingot. As the properties are not visible from the outside, an online monitoring during the forging process is required. By using modern measuring equipment and fast calculation models, the equivalent strain, temperature and average grain size in the core fibre of a forging ingot can be calculated parallel to the process. Software implementing the fast calculation models has been established and connected to the measuring system of two different open die forging presses. Two experimental forging processes with ten passes have been performed (20 ton steel ingot, 750 kg Ni-base alloy ingot). Parallel to the process, the current strain, temperature and average grain size in the centre of the ingot are visualised in the graphic user interface and recorded by the process monitor. It was shown that the calculation speed is high enough to allow online capability. After finishing the process, the developed software can further be used to analyse in detail the impact of every single stroke or pass on the whole process. Additionally, information like minimum or maximum grain size or recrystallized fraction is calculated and can be used to get insight into the process and optimize its design. Comparing the metallographically measured average grain size from experiment with the grain size estimated by the process monitor, the average deviation of three measured points is less than 13 %.