Design and Analysis of Resonant Wireless Power Transfer System

In this paper, the modelling and analysis of resonant wireless power transfer (RWPT) system are carried out by using circuit theory. Equations of the efficiency and frequency are derived for basic series-series circuit topology and series-parallel-mixed circuit topology. The designed model uses the series-parallel-mixed topology. The model is tested for two different peak-to-peak voltage levels including 20 V and 40 V. The achieved efficiency at 20 V is 49.10% and at 40 V is 49.52% approximately. The modelling is performed by using advanced design system (ADS) high frequency design software. In addition, an overview of currently available wireless power transfer (WPT) technologies and the recent study on inductive wireless power transfer (IWPT) and resonant wireless power transfer (RWPT) systems is also presented.

Transformerless SoC-based current control switching battery charger for e-vehicle: design and analysis

Electric-based vehicles become a necessity in the future to dramatically reduce the effects of pollution. There are various devices involve in the operation of electric vehicles, one of which is a battery charger. This paper discusses the design steps, circuit and ripple performance analysis associated with building a battery charger system. The analysis shows the differences between RL and RC circuits in controlling the output voltage average and the ripples. It shows how RLC mixed circuit improve performance in both controlling the output voltage average and the ripple suppression.

PEMBELAJARAN GUIDED DISCOVERY DALAM UPAYA REMEDIASI MISKONSEPSI MATERI LISTRIK DINAMIS CALON GURU

This study aims to remediate student misconceptions on dynamic electrical materials. Remediation activities are conducted in two stages. First, the development of guided discovery learning devices and misconception diagnostic test instruments. The development follows the 4-D model stage. The second phase is, the implementation of learning in 35 students of Physics Education in 2011 State University of Surabaya through Design One Group Pretest-Posttest Design. Student misconceptions data were analyzed by CRI analysis and learning implementation data were analyzed by mean of stepping. The data of the research shows that the average value of learning is 3.6 (very good category). Initial misconception profiles are found on every concept before learning and decline after remediation. At the drift speed concept, students experienced misconceptions 66% and 31% after application. In the concept of 'Ohm's law' 26% to 3%, source voltage parallel series strewed 71% to 43%, current consumption model 63% to 46%, series and parallel impact on power 80% to 46%, energy on battery 40% to 37%, electrical circuit typology 69% to 51%, electric power in mixed circuit 51% to 17%, current on a circuit 40% to 11%, potential difference between two points 43% to 9%, use of measuring instrument electricity (ampermeter and voltmeter) in the series 37% to 26%, and Kirchhoff rules 20% to 26%. The results of this data analysis can be concluded that the learning tools developed can reduce student misconception.

Application of Support Vector Machine in the Mixed Circuit Fault Diagnosis

Proposed a mixed circuit fault diagnosis method based on support vector machines for the lower rate of mixed circuit fault diagnosis and diagnosis slower. The basic idea is the use of wavelet decomposition to extract the dynamic current of the mixed circuit, and re-integration of the SVM fault diagnosis. By PSPICE software and MATLAB software simulation analysis of the mixed circuit, simulation results show that this method can improve the convergence speed of the BP neural network, and can make the BP neural network is not easy to fall into local minimum value, so that the network has a better pattern recognition capability. This laid the foundation for the completion of a more rapid and accurate mixed circuit fault diagnosis.

The Application of Improved SVM in Mixed Circuit

In order to improve the speed and the rate of fault diagnosis in mixed circuit, this paper introduces a new fault diagnosis method. Through extracting fault features of current characteristics effectively and applying to Improved SVM, the ability of pattern recognition will be better than the traditional BP Neural Network and Single SVM, especially in small samples or non-linear cases. Meanwhile, this paper presents the lifting wavelet transform in order to obtain the feature information accurately. The accuracy of fault diagnosis can greatly enhance by discussing the Improved SVM combined with lifting wavelet transform in a specific monostable trigger. That points out a new direction for the fault diagnosis of mixed circuit.

Modeling of Low Frequency Multi-Source Energy Harvesting Systems

Accurate modeling of multi-source harvesters present design challenges such as the integration of mixed circuit topologies, passive versus active topologies, impedance matching, and optimization. Commercial modeling and simulation software packages offer solutions but often times are not comprehensive enough. In this work P-Spice, Simulink, and Comsol Multiphysics were used to model a multi-source energy harvesting system that incorporates the energy producing capabilities of the piezoelectric, the pyroelectric, and thermoelectric effect. A systems approach that models the material properties of the converters, the power electronics and storage was implemented. Low frequency experimental data from PZT based harvesters and thermoelectric generators were used to produce lumped parameter models. It was demonstrated that within 12% that combining effects may contribute to continuous energy harvesting operation.

Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power packages, including three parts: (1) Thermal simulation and die bond defect control (2) Mechanical integrity model for soft package heatsink implementation (3) Al wire multiphysics modeling and reliability of plastic power package.