High Performance a-Si:H TFT Driven Linear Image Sensor with New Multiplex Structure for G4 Facsimile

1990 ◽  
Author(s):  
Hiroyuki MIYAKE ◽  
Mamoru NOBUE ◽  
Kazuhiro SAKAI ◽  
Tsutomu ABE ◽  
Yoshihiko SAKAI ◽  
...  
Keyword(s):  
High Performance ◽  
Image Sensor

scholarly journals Performance Analysis and Improvement of Optical Camera Communication

2018 ◽  
Vol 8 (12) ◽  
pp. 2527 ◽  
Author(s):  
Moh. Khalid Hasan ◽  
Mostafa Zaman Chowdhury ◽  
Md. Shahjalal ◽  
Van Thang Nguyen ◽  
Yeong Min Jang
Keyword(s):  
User Satisfaction ◽  
High Performance ◽  
Focal Length ◽  
Sampling Rate ◽  
Image Sensor ◽  
Edge Length ◽  
Data Rate ◽  
Principal Factors ◽  
Communication Distance ◽  
Optical Camera Communication

Optical camera communication (OCC) is a technology in which a camera image sensor is employed to receive data bits sent from a light source. OCC has attracted a lot of research interest in the area of mobile optical wireless communication due to the popularity of smartphones with embedded cameras. Moreover, OCC offers high-performance characteristics, including an excellent signal-to-interference-plus-noise ratio (SINR), high security, low interference, and high stability with respect to varying communication distances. Despite these advantages, OCC suffers from several limitations, the primary of which is the low data rate. In this paper, we provide a comprehensive analysis of the parameters that influence the OCC performance. These parameters include the camera sampling rate, the exposure time, the focal length, the pixel edge length, the transmitter configurations, and the optical flickering rate. In particular, the focus is on enhancing the data rate, SINR, and communication distance, which are the principal factors determining the quality of service experienced by a user. The paper also provides a short survey of modulation schemes used in OCC on the basis of the achieved data rate, communication distance, and possible application scenarios. A theoretical analysis of user satisfaction using OCC is also rendered. Furthermore, we present the simulation results demonstrating OCC performance with respect to variations in the parameters mentioned above, which include the outage probability analysis for OCC.

A Wearable Supporting System for Visually Impaired People in Operating Capacitive Touchscreen

2011 ◽  
Vol 103 ◽  
pp. 687-694
Author(s):  
Akira Yamawaki ◽  
Serikawa Seiichi
Keyword(s):  
Image Processing ◽  
Visually Impaired ◽  
High Performance ◽  
Middle Finger ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Supporting System ◽  
Visually Impaired People ◽  
Impaired People ◽  
Natural Way

We propose a wearable supporting system with a CMOS image sensor for the visually impaired people in operating capacitive touchscreen. This system attaches the CMOS image sensor without a lens to the tip of the middle finger. The icons and buttons displayed on the touchscreen are replaced to the color barcodes. Touching the surface of the touchscreen with the CMOS image sensor directly, the color barcode is detected and decoded. The decoded results are returned to the user by some interaction like audio. Then, the user touches the button area around the color barcode by the forefinger to operate the target device. This system can provide very easy and natural way for operating the touchscreen to the visually impaired people who usually recognize the materials by the finger. Any mechanical modification of the target device is not needed. The modification can be made by changing its software program. Since the color barcode is sensed by the image sensor without any lens touching the surface of the touchscreen, each bar in the color barcode should be blurred. So, we　develop an easy and simple image processing to handle such problem. We design it as the hardware module to achieve the high performance and low-power wearable device. A prototype hardware using an FPGA shows the hardware size, the performance and the actual demonstration.

Synthesis and Blue Pixel Property of New Violet Dye for Image Sensors

2021 ◽  
Vol 21 (7) ◽  
pp. 3996-3999
Author(s):  
Sunwoo Park ◽  
Seokwoo Kang ◽  
Hokyeom Kim ◽  
Sanshin Park ◽  
Hyukmin Kwon ◽  
...  
Keyword(s):  
Chemical Stability ◽  
High Performance ◽  
Physical Property ◽  
Color Difference ◽  
Image Sensor ◽  
Image Sensors ◽  
Blue Pigment ◽  
Coating Film ◽  
Pigment System ◽  
Thermal And Chemical Stability

In this study, a blue photoresist with the hybrid dye-pigment system was developed by mixing xanthene-based dye (XPDIA) and blue pigment 15:6 (1:1, 5 wt% of total mixture amount) in order to develop high-performance image sensors with high thermal and chemical stability. The colorant used in this study has the nano-sized particle of around 100 nm and the physical property is related with the photonic property in image sensor application such as the cameras of mobile phone, car black box, security, etc. The hybrid dye-pigment system showed a high transmittance of more than 90% at 450 nm, and Δab showed very low color difference of 0.52. In solvent resistance, high transmittance of 90% was perfectly maintained, and Δab showed low color difference of 1.08. Migration test result exhibited no change at all after dipping in PGMEA transmittance spectrum. These results are due to the high absorption optical properties of XPDIA dye in the HDPS and the high thermal and chemical stability properties of the PB15:6 pigment. As a result, it was confirmed that the mixed blue hybrid spin coating film exhibited excellent thermal and chemical stability as well as good optical property.

High Performance 400DPI A4 size Contact Image Sensor (CIS) module for Scanner and G4 Fax Applications

1991 ◽  
Author(s):  
Long-Ching Yeh ◽  
Way-Chen Wu ◽  
Ru-Shyah Tang ◽  
Yong-Song Tsai ◽  
Eugene Chiang ◽  
...  
Keyword(s):  
High Performance ◽  
Image Sensor

scholarly journals Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4077
Author(s):  
Tianshen Zhou ◽  
Shuying Ma ◽  
Daquan Yu ◽  
Ming Li ◽  
Tao Hang
Keyword(s):  
High Performance ◽  
Dynamic Range ◽  
High Reliability ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Automotive Application ◽  
Market Demand ◽  
Wafer Level ◽  
Reliability Performance ◽  
Silicon Vias

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.

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