Quantitative Evaluation of Dopant Concentration in Shallow Silicon p–n Junctions by Tunneling Current Mapping with Multimode Scanning Probe Microscopy

2013 ◽  
Vol 52 (4S) ◽  
pp. 04CA04 ◽  
Author(s):  
Leonid Bolotov ◽  
Koichi Fukuda ◽  
Hiroshi Arimoto ◽  
Tetsuya Tada ◽  
Toshihiko Kanayama
Author(s):  
Kannan M. Krishnan

Scanning probe microscopy (SPM) scans a fine tip close to a surface and measures the tunneling current (STM) or force (SFM), based on many possible tip-surface interactions. STM provides atomic resolution imaging, or the local electronic structure (spectroscopy) as a function of bias voltage, and is also used to manipulate adsorbed atoms on a clean surface. STM operates in two modes— constant current or height—and requires a conducting specimen. SFM uses a cantilever (force sensor) to measure short range (< 1 nm) chemical, and a variety of long-range (< 100 nm) forces, depending on the tip and the specimen; a conducting specimen is not required. In static mode, the tip height is controlled to maintain a constant force, and measure surface topography. In dynamic mode, changes in the vibrational properties of the cantilever are measured using frequency, amplitude, or phase modulation as feedback to control the tip-surface distance and form the image. Dynamic imaging includes contact and non-contact modes, but intermittent contact or tapping mode is common. SPMs measure properties (optical, acoustic, conductance, electrochemical, capacitance, thermal, magnetic, etc.) using appropriate tips, and find applications in the physical and life sciences. They are also used for nanoscale lithography.


Nanomaterials ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 1506
Author(s):  
Huan Fei Wen ◽  
Yasuhiro Sugawara ◽  
Yan Jun Li

We studied the O2 dissociated state under the different O2 exposed temperatures with atomic resolution by scanning probe microscopy (SPM) and imaged the O adatom by simultaneous atomic force microscopy (AFM)/scanning tunneling microscopy (STM). The effect of AFM operation mode on O adatom contrast was investigated, and the interaction of O adatom and the subsurface defect was observed by AFM/STM. Multi-channel exploration was performed to investigate the charge transfer between the adsorbed O and the TiO2(110) by obtaining the frequency shift, tunneling current and local contact potential difference at an atomic scale. The tunneling current image showed the difference of the tunneling possibility on the single O adatom and paired O adatoms, and the local contact potential difference distribution of the O-TiO2(110) surface institutively revealed the charge transfer from TiO2(110) surface to O adatom. The experimental results are expected to be helpful in investigating surface/interface properties by SPM.


Author(s):  
Kevin M. Shakesheff ◽  
Martyn C. Davies ◽  
Clive J. Roberts ◽  
Saul J. B. Tendler ◽  
Philip M. Williams

Author(s):  
Benedict Drevniok ◽  
St. John Dixon-Warren ◽  
Oskar Amster ◽  
Stuart L Friedman ◽  
Yongliang Yang

Abstract Scanning microwave impedance microscopy was used to analyze a CMOS image sensor sample to reveal details of the dopant profiling in planar and cross-sectional samples. Sitespecific capacitance-voltage spectroscopy was performed on different regions of the samples.


Author(s):  
Swaminathan Subramanian ◽  
Khiem Ly ◽  
Tony Chrastecky

Abstract Visualization of dopant related anomalies in integrated circuits is extremely challenging. Cleaving of the die may not be possible in practical failure analysis situations that require extensive electrical fault isolation, where the failing die can be submitted of scanning probe microscopy analysis in various states such as partially depackaged die, backside thinned die, and so on. In advanced technologies, the circuit orientation in the wafer may not align with preferred crystallographic direction for cleaving the silicon or other substrates. In order to overcome these issues, a focused ion beam lift-out based approach for site-specific cross-section sample preparation is developed in this work. A directional mechanical polishing procedure to produce smooth damage-free surface for junction profiling is also implemented. Two failure analysis applications of the sample preparation method to visualize junction anomalies using scanning microwave microscopy are also discussed.


Author(s):  
Tsan-Chang Chuang ◽  
Cha-Ming Shen ◽  
Shi-Chen Lin ◽  
Chen-May Huang ◽  
Jin-Hong Chou ◽  
...  

Abstract Scanning capacitance microscopy (SCM) is a 2-D carrier and/or dopant concentration profiling technique under development that utilizes the excellent spatial resolution of scanning probe microscopy. However, PV-SCM has limited capability to achieve the goal due to inherent "plane" trait. On top of that, deeper concentration profile just like deep N-well is also one of restrictions to use. For representing above contents more clearly, this paper presents a few cases that demonstrate the alternated and optimized application of PV-SCM and X-SCM. The case studies concern Joint Test Action Group failure and stand-by failure. These cases illustrate that the correct selection from either plane-view or cross-sectional SCM analysis according to the surrounding of defect could help to exactly and rapidly diagnose the failure mechanism. Alternating and optimizing PV-SCM and X-SCM techniques to navigate various implant issue could provide corrective actions that suit local circumstance of defects and identify the root cause.


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