scholarly journals A novel high-power semiconductor laser diode with large cavity for high efficiency coupling with the optical fibers

2007 ◽  
Vol 56 (7) ◽  
pp. 3945
Author(s):  
Yu Hai-Ying ◽  
Cui Bi-Feng ◽  
Chen Yi-Xin ◽  
Zou De-Shu ◽  
Liu Ying ◽  
...  
IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 92805-92812 ◽  
Author(s):  
Qinglin Zhao ◽  
Shu Li ◽  
Ruru Cao ◽  
Deyu Wang ◽  
Jing Yuan

2019 ◽  
Vol 31 (7) ◽  
pp. 2183
Author(s):  
Shun-Lung Yen ◽  
Shiang-Feng Tang ◽  
Chung-Wei Ou ◽  
Chin-Jung Chao ◽  
Hsin-Yen Cheng ◽  
...  

2011 ◽  
Vol 32 (5) ◽  
pp. 054007 ◽  
Author(s):  
Weijiang Lai ◽  
Yuanbing Cheng ◽  
Chen Yao ◽  
Daibing Zhou ◽  
Jing Bian ◽  
...  

2021 ◽  
Vol 9 ◽  
Author(s):  
Yixiong Yan ◽  
Yu Zheng ◽  
Haigang Sun ◽  
Ji’an Duan

In the past 20 years, semiconductor lasers have been widely used in medical, industrial, and communication applications, providing a revolutionary and powerful platform for the fifth generation and advanced manufacturing. Semiconductor laser has the advantages of small size, lightweight, high reliability and easy modulation, becoming increasingly popular. However, due to the laser diode emission mechanism limitation, the beam quality is inferior and cannot be directly applied and required to be handled by beam shaping. However, the packaging of multiple beam shaping optical components is accompanied by risks due to misalignment. The misalignment error of the optical components has a great hidden danger to the laser performance. As semiconductor lasers' power gradually increases, lasers' thermal management technology is also increasingly strict. Therefore, this article first reviews the beam shaping technology of semiconductor laser diode array. Secondly, the analysis of the influence of the array semiconductor laser optical device's misalignment is reviewed, and a feasible solution is proposed. Finally, it summarizes the researches on thermal management in high-power semiconductor lasers. This article aims to give readers a comprehensive and broad understanding of semiconductor laser packaging's technical difficulties and to recognize each corresponding solution.


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