scholarly journals Grain Boundary in Oxide Scale During High-Temperature Metal Processing

Author(s):  
Xianglong Yu ◽  
Zhou Ji
Author(s):  
Michal Krzyzanowski ◽  
John H. Beynon ◽  
Didier C. J. Farrugia

Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3764
Author(s):  
Krzysztof Aniołek ◽  
Adrian Barylski ◽  
Marian Kupka

High-temperature oxidation was performed at temperatures from 600 to 750 °C over a period of 24 h and 72 h. It was shown in the study that the oxide scale became more homogeneous and covered the entire surface as the oxidation temperature increased. After oxidation over a period of 24 h, the hardness of the produced layers increased as the oxidation temperature increased (from 892.4 to 1146.6 kgf/mm2). During oxidation in a longer time variant (72 h), layers with a higher hardness were obtained (1260 kgf/mm2). Studies on friction and wear characteristics of titanium were conducted using couples with ceramic balls (Al2O3, ZrO2) and with high-carbon steel (100Cr6) balls. The oxide films produced at a temperature range of 600–750 °C led to a reduction of the wear ratio value, with the lowest one obtained in tests with the 100Cr6 steel balls. Frictional contact of Al2O3 balls with an oxidized titanium disc resulted in a reduction of the wear ratio, but only for the oxide scales produced at 600 °C (24 h, 72 h) and 650 °C (24 h). For the ZrO2 balls, an increase in the wear ratio was observed, especially when interacting with the oxide films obtained after high-temperature oxidation at 650 °C or higher temperatures. The increase in wear intensity after titanium oxidation was also observed for the 100Cr6 steel balls.


2001 ◽  
Vol 670 ◽  
Author(s):  
Min-Joo Kim ◽  
Hyo-Jick Choi ◽  
Dae-Hong Ko ◽  
Ja-Hum Ku ◽  
Siyoung Choi ◽  
...  

ABSTRACTThe silicidation reactions and thermal stability of Co silicide formed from Co-Ta/Si systems have been investigated. In case of Co-Ta alloy process, the formation of low resistive CoSi2phase is delayed to about 660°C, as compared to conventional Co/Si system. Moreover, the presence of Ta in Co-Ta alloy films reduces the silicidation reaction rate, resulting in the strong preferential orientation in CoSi2 films. Upon high temperature post annealing in the furnace, the sheet resistance of Co-silicide formed from Co/Si systems increases significantly, while that of Co-Ta/Si systems maintains low. This is due to the formation of TaSi2 at the grain boundaries and surface of Co-silicide films, which prevents the grain boundary migration thereby slowing the agglomeration. Therefore, from our research, increased thermal stability of Co-silicide films was successfully obtained from Co-Ta alloy process.


2009 ◽  
Vol 51 (2) ◽  
pp. 309-315 ◽  
Author(s):  
Lucía Suárez ◽  
Yvan Houbaert ◽  
Xavier Vanden Eynde ◽  
Rafael Colás

Metal Science ◽  
1981 ◽  
Vol 15 (2) ◽  
pp. 73-78 ◽  
Author(s):  
K. U. Snowden ◽  
D. S. Hughes ◽  
P. A. Stathers

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