scholarly journals Laser Ablation Applications in Ablation-Resistance Characterization of Materials

10.5772/65108 ◽  
2016 ◽  
Author(s):  
Yonggang Tong ◽  
Xiubing Liang ◽  
Shuxin Bai ◽  
Qing H. Qin
Keyword(s):  
Laser Ablation ◽  
Ablation Resistance ◽  
Characterization Of Materials

Characterization of materials ejected by excimer laser ablation of hydrated collagen gel

2002 ◽  
Vol 197-198 ◽  
pp. 782-785 ◽  
Author(s):  
Katsunori Tsunoda ◽  
Daisuke Kumaki ◽  
Teruo Takahashi ◽  
Hirofumi Yajima ◽  
Tadahiro Ishii ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Collagen Gel ◽  
Excimer Laser Ablation ◽  
Characterization Of Materials ◽  
Hydrated Collagen Gel

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

Applications of ultramicrotomy for materials characterization

1993 ◽  
Vol 51 ◽  
pp. 232-233
Author(s):  
R.T. Blackham ◽  
J.J. Haugh ◽  
C.W. Hughes ◽  
M.G. Burke
Keyword(s):  
Materials Science ◽  
Microstructural Analysis ◽  
Analytical Electron Microscopy ◽  
Austenitic Stainless Steels ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Thermally Induced ◽  
Radiation Induced ◽  
Characterization Of Materials

Essential to the characterization of materials using analytical electron microscopy (AEM) techniques is the specimen itself. Without suitable samples, detailed microstructural analysis is not possible. Ultramicrotomy, or diamond knife sectioning, is a well-known mechanical specimen preparation technique which has been gaining attention in the materials science area. Malis and co-workers and Glanvill have demonstrated the usefulness and applicability of this technique to the study of a wide variety of materials including Al alloys, composites, and semiconductors. Ultramicrotomed specimens have uniform thickness with relatively large electron-transparent areas which are suitable for AEM anaysis.Interface Analysis in Type 316 Austenitic Stainless Steel: STEM-EDS microanalysis of grain boundaries in austenitic stainless steels provides important information concerning the development of Cr-depleted zones which accompany M23C6 precipitation, and documentation of radiation induced segregation (RIS). Conventional methods of TEM sample preparation are suitable for the evaluation of thermally induced segregation, but neutron irradiated samples present a variety of problems in both the preparation and in the AEM analysis, in addition to the handling hazard.

Characterization of aluminum, brass and steel nanoparticles after laser ablation

2009 ◽  
Author(s):  
Nancy Van Suetendael ◽  
Kristie Powell ◽  
Susan Earles ◽  
Mary Helen McCay ◽  
Ivica Kostanic
Keyword(s):  
Laser Ablation

Free-Space Electromagnetic Characterization of Materials for Microwave and Radar Applications

PIERS Online ◽  
2005 ◽  
Vol 1 (2) ◽  
pp. 128-132 ◽  
Author(s):  
Habiba Hafdallah Ouslimani ◽  
Redha Abdeddaim ◽  
Alain Priou
Keyword(s):  
Free Space ◽  
Radar Applications ◽  
Characterization Of Materials

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

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