scholarly journals Plant Integrity – The Important Factor of Adaptability to Stress Conditions

Author(s):  
Ladislav Bláha ◽  
Tomáš Streda
Crisis ◽  
2012 ◽  
Vol 33 (2) ◽  
pp. 106-112 ◽  
Author(s):  
Christopher M. Bloom ◽  
Shareen Holly ◽  
Adam M. P. Miller

Background: Historically, the field of self-injury has distinguished between the behaviors exhibited among individuals with a developmental disability (self-injurious behaviors; SIB) and those present within a normative population (nonsuicidal self-injury; NSSI),which typically result as a response to perceived stress. More recently, however, conclusions about NSSI have been drawn from lines of animal research aimed at examining the neurobiological mechanisms of SIB. Despite some functional similarity between SIB and NSSI, no empirical investigation has provided precedent for the application of SIB-targeted animal research as justification for pharmacological interventions in populations demonstrating NSSI. Aims: The present study examined this question directly, by simulating an animal model of SIB in rodents injected with pemoline and systematically manipulating stress conditions in order to monitor rates of self-injury. Methods: Sham controls and experimental animals injected with pemoline (200 mg/kg) were assigned to either a low stress (discriminated positive reinforcement) or high stress (discriminated avoidance) group and compared on the dependent measures of self-inflicted injury prevalence and severity. Results: The manipulation of stress conditions did not impact the rate of self-injury demonstrated by the rats. The results do not support a model of stress-induced SIB in rodents. Conclusions: Current findings provide evidence for caution in the development of pharmacotherapies of NSSI in human populations based on CNS stimulant models. Theoretical implications are discussed with respect to antecedent factors such as preinjury arousal level and environmental stress.


Planta Medica ◽  
2014 ◽  
Vol 80 (10) ◽  
Author(s):  
F Nabbie ◽  
O Shperdheja ◽  
J Millot ◽  
J Lindberg ◽  
B Peethambaran

2015 ◽  
Vol 6 (2) ◽  
Author(s):  
Nur Hidaayah

Stress conditions in the elderly means an imbalance condition of biological, psychological, and social are closely related to the response to the threats and dangers faced by the elderly. Pressure or interference that is not fun is usually created when the elderly see a mismatch between the state and the 3 systems available resources. Maintenance actions that need to be done there are 2 types, namely : prevention of exposure to a stressor (precipitation factor) and serious treatment of the imbalance condition/ illness (precipitation factor). Prevention includes: sports, hobbies, friendship, avoid eating foods high in free radicals and harmful substances, sex and setting arrangements adequate rest. Habits of the above if done at a young age to avoid exposure to stress in the elderly. Treatment of the imbalance condition / illness, include : drinking water, meditation, eating fresh fruit, and adequate rest.


2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


Sign in / Sign up

Export Citation Format

Share Document