scholarly journals Spectroscopic Analyses of Nano-Dispersion Strengthened Transient Liquid Phase Bonds

10.5772/48086 ◽  
2012 ◽  
Author(s):  
Kavian Cooke
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Spectroscopic Analyses

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021 ◽  
pp. 095440542098823
Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri
Keyword(s):  
Liquid Phase ◽  
Mechanical Test ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Joint Interface ◽  
Test Results ◽  
X Ray Diffraction ◽  
X Ray ◽  
Metallic Particles ◽  
Powder Interlayer

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

scholarly journals Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

2020 ◽  
Vol 923 ◽  
pp. 012006
Author(s):  
B. Benita ◽  
D.S. Samuvel Prem Kumar ◽  
R. Pravin ◽  
N.Samuel Dinesh Hynes ◽  
J.Angela Jennifa Sujana
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Interlayer Thickness

Transient liquid phase (TLP) bonding of TiAl/Ti6242 with Ti–Cu foil

2004 ◽  
Vol 9 (6) ◽  
pp. 525-531 ◽  
Author(s):  
H. Duan ◽  
M. Koçak ◽  
K.-H. Bohm ◽  
V. Ventzke
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Tlp Bonding ◽  
Cu Foil
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