scholarly journals Lead-Free Wrought Copper Alloys for Bushings and Sliding Elements

Author(s):  
Kai Weber ◽  
H.-A. Kuh
Keyword(s):  
2007 ◽  
Vol 71 (10) ◽  
pp. 885-889
Author(s):  
Atsushi Nakano ◽  
Nurul Taufiqu Rochman ◽  
Hidekazu Sueyoshi
Keyword(s):  

2005 ◽  
Vol 46 (12) ◽  
pp. 2713-2718 ◽  
Author(s):  
Atsushi Nakano ◽  
Nurul Taufiqu Rochman ◽  
Hidekazu Sueyoshi
Keyword(s):  

2018 ◽  
Vol 26 ◽  
pp. 34
Author(s):  
Umeda Takateru

The regulation for the lead discharge in the environment was strengthened, in Japan, the standards 0.01 mg/I or less has been in force from April 2003. In order to meet the new standard, two technologies for reduction of lead dissolution into the drinking water have been developed in Japan; substitution of lead free copper alloys for lead bearing bronze (JIS-CAC406) and introduction of surface treatment technology. This technological trend was shortly reviewed. For development of lead free copper alloy casting, mechanical properties, castability and machinability of various lead free alloy castings were examined. Trial alloys used were commercially available ones such as the lead free bronze containing Bi, the lead free bronze containing Bi-Se, the lead free bronze containing Bi-Sb and the lead free brass containing Si. Mechanical properties of alloys were dependent on the pouring temperature and castings thickness and were generally less than those of tin bronze castings (JIS-CAC406, Cu-5 wt% Sn-5 wt% Zn-5 wt% Pb). The machinability of the lead free bronze containing Bi and Se was better than that of the lead free bronze castings containing Bi and Bi-Sb. But was still 10 to 15 % less than that of JIS-CAC406. In a lead free alloy substituted by Bi, adjustment of tin, zinc and bismuth contents was attempted and in the Bi-Se system, the adequate adjustment, for bismuth and selenium contents and also for tin, zinc and bismuth contents, was attempted. New alloy in which the mechanical properties sufficiently satisfy the standard for JIS-CAC406 is developed.


2015 ◽  
Vol 812 ◽  
pp. 357-362 ◽  
Author(s):  
Erzsébet Nagy ◽  
Anett Gyenes ◽  
Alíz Molnár ◽  
Zoltán Gácsi

Industry should gradually replace the tin-lead solder alloys used traditionally in the soft soldering technology by lead-free soldering alloys, which raises a lot of new technological and scientific problems to be solved. The introduction and application of lead-free alloys caused a number of soldering defects not observed earlier; mechanisms of their formation are still unclear. One of such defects is whisker formation, another one is intensified formation of intermetallic phases. The appearance of undesired intermetallic phases in the soldering material spoils its mechanical properties; therefore it is particularly important that these phases do not form in electronic components. Besides, the formation of intermetallic compounds may occur in the soldering bath, thus making the soldering process difficult or even impossible.Tin-copper-nickel and tin-silver-copper alloys are suitable for the replacement of tin-lead alloys. The components of these alloys were studied. After metallographic examination of the specimens the occurrence of intermetallic phases was determined by the XRD method. The identification of intermetallic phases was carried out by using literature data and phase diagrams.


2015 ◽  
Vol 15 (5) ◽  
pp. 870-875 ◽  
Author(s):  
Jan Madl ◽  
Vaclav Koutny
Keyword(s):  

Author(s):  
R. W. Fonda ◽  
D. E. Luzzi

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.


Author(s):  
W. A. Chiou ◽  
N. Kohyama ◽  
B. Little ◽  
P. Wagner ◽  
M. Meshii

The corrosion of copper and copper alloys in a marine environment is of great concern because of their widespread use in heat exchangers and steam condensers in which natural seawater is the coolant. It has become increasingly evident that microorganisms play an important role in the corrosion of a number of metals and alloys under a variety of environments. For the past 15 years the use of SEM has proven to be useful in studying biofilms and spatial relationships between bacteria and localized corrosion of metals. Little information, however, has been obtained using TEM capitalizing on its higher spacial resolution and the transmission observation of interfaces. The research presented herein is the first step of this new approach in studying the corrosion with biological influence in pure copper.Commercially produced copper (Cu, 99%) foils of approximately 120 μm thick exposed to a copper-tolerant marine bacterium, Oceanospirillum, and an abiotic culture medium were subsampled (1 cm × 1 cm) for this study along with unexposed control samples.


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