Committee Summary Report: Corrosion Testing for Lead-Free Copper Alloys Used for Drinking Water Applications in Underground Environments

2018 ◽  
Vol 110 (12) ◽  
pp. 54-57
Author(s):  
10.2172/1828 ◽  
1998 ◽  
Author(s):  
BP McGrail ◽  
CW Lindenmeier ◽  
HT Schaef ◽  
PF Martin

2007 ◽  
Vol 71 (10) ◽  
pp. 885-889
Author(s):  
Atsushi Nakano ◽  
Nurul Taufiqu Rochman ◽  
Hidekazu Sueyoshi
Keyword(s):  

2005 ◽  
Vol 46 (12) ◽  
pp. 2713-2718 ◽  
Author(s):  
Atsushi Nakano ◽  
Nurul Taufiqu Rochman ◽  
Hidekazu Sueyoshi
Keyword(s):  

2018 ◽  
Vol 26 ◽  
pp. 34
Author(s):  
Umeda Takateru

The regulation for the lead discharge in the environment was strengthened, in Japan, the standards 0.01 mg/I or less has been in force from April 2003. In order to meet the new standard, two technologies for reduction of lead dissolution into the drinking water have been developed in Japan; substitution of lead free copper alloys for lead bearing bronze (JIS-CAC406) and introduction of surface treatment technology. This technological trend was shortly reviewed. For development of lead free copper alloy casting, mechanical properties, castability and machinability of various lead free alloy castings were examined. Trial alloys used were commercially available ones such as the lead free bronze containing Bi, the lead free bronze containing Bi-Se, the lead free bronze containing Bi-Sb and the lead free brass containing Si. Mechanical properties of alloys were dependent on the pouring temperature and castings thickness and were generally less than those of tin bronze castings (JIS-CAC406, Cu-5 wt% Sn-5 wt% Zn-5 wt% Pb). The machinability of the lead free bronze containing Bi and Se was better than that of the lead free bronze castings containing Bi and Bi-Sb. But was still 10 to 15 % less than that of JIS-CAC406. In a lead free alloy substituted by Bi, adjustment of tin, zinc and bismuth contents was attempted and in the Bi-Se system, the adequate adjustment, for bismuth and selenium contents and also for tin, zinc and bismuth contents, was attempted. New alloy in which the mechanical properties sufficiently satisfy the standard for JIS-CAC406 is developed.


2015 ◽  
Vol 812 ◽  
pp. 357-362 ◽  
Author(s):  
Erzsébet Nagy ◽  
Anett Gyenes ◽  
Alíz Molnár ◽  
Zoltán Gácsi

Industry should gradually replace the tin-lead solder alloys used traditionally in the soft soldering technology by lead-free soldering alloys, which raises a lot of new technological and scientific problems to be solved. The introduction and application of lead-free alloys caused a number of soldering defects not observed earlier; mechanisms of their formation are still unclear. One of such defects is whisker formation, another one is intensified formation of intermetallic phases. The appearance of undesired intermetallic phases in the soldering material spoils its mechanical properties; therefore it is particularly important that these phases do not form in electronic components. Besides, the formation of intermetallic compounds may occur in the soldering bath, thus making the soldering process difficult or even impossible.Tin-copper-nickel and tin-silver-copper alloys are suitable for the replacement of tin-lead alloys. The components of these alloys were studied. After metallographic examination of the specimens the occurrence of intermetallic phases was determined by the XRD method. The identification of intermetallic phases was carried out by using literature data and phase diagrams.


RSC Advances ◽  
2019 ◽  
Vol 9 (55) ◽  
pp. 32184-32196 ◽  
Author(s):  
I. B. Gomes ◽  
L. C. Simões ◽  
M. Simões

Copper alloys demonstrated comparable or higher performance than elemental copper in biofilm control. The alloy containing 96% copper was the most promising surface in biofilm control and regrowth prevention.


CORROSION ◽  
10.5006/2770 ◽  
2018 ◽  
Vol 74 (8) ◽  
pp. 914-917 ◽  
Author(s):  
Jeffrey Parks ◽  
Kelsey J. Pieper ◽  
Adrienne Katner ◽  
Min Tang ◽  
Marc Edwards

Concern about lead in drinking water has heightened since the Flint water crisis. Moreover, recent medical evidence increasingly shows damage to children’s health at levels of lead exposure once considered low. In order to better protect children from these hazards, the American Academy of Pediatrics (AAP) recommends that drinking water in public schools does not exceed 1 μg/L lead. Meeting this goal with current plumbing and fixtures will be challenging, because current “lead-free” standards did not anticipate targets this low. Three styles of recently manufactured “lead-free” faucets were tested and average lead leaching ranged from 1.5 μg/L to 3.0 μg/L after 19 d. Given that the NSF/ANSI 61 test water is less aggressive than some potable waters, even newly manufactured “lead-free” faucets may not meet the standards recommended by AAP.


2021 ◽  
Vol 1016 ◽  
pp. 1448-1453
Author(s):  
Hikaru Tajima ◽  
Yuta Nakamura ◽  
Yasuyuki Miyazawa ◽  
Hidenobu Tameda

Conventionally, brass has toughness more than other metals, so there is a concern about its poor machinability. Therefore, improvement of machinability was attempted by adding lead to brass. This brass called free cutting brass, typified by JIS C3771. This free-cutting brass is used for piping components and machine parts. There is a concern about elution of the lead into drinking water. Hence, Drinking Water Quality Standards Law has been amended and it restricts lead content in the free cutting brass. Therefore, lead-free free-cutting brass with no lead or minimized content of lead is required.Consequently, a lead-free free-cutting brass had been developed to improve in machinability such as JIS C6931 and JIS C6803 that are added Si and Bi instead of lead respectively. Lead was also used for the solder for joining among pure copper pipes and brass valves. That causes elution of lead from the solder into drinking water. For this reason, Lead-free solder such as Sn-Sb and Sn-Ag-Cu have been used.A fire torch technology often was used for soldering of brass. The purpose of this study is investigating soldering-ability and wettability of lead-free solder on lead-free free-cutting brass. Hence, we investigated the soldering ability of lead-free solders, Sn-5%Sb and Sn-3%Ag-0.5%Cu, for pure Cu and brass joints with nonuniform heating by hot plate.


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