scholarly journals Simulation of Liquid Flow Permeability for Dendritic Structures during Solidification Process

10.5772/19647 ◽  
2011 ◽  
Author(s):  
S. M. H. Mirbagheri ◽  
H. Baiani ◽  
M. Barzegari ◽  
S. Firoozi
Keyword(s):  
Liquid Flow ◽  
Solidification Process ◽  
Dendritic Structures

Numerical determination of liquid flow permeabilities for equiaxed dendritic structures

2002 ◽  
Vol 50 (6) ◽  
pp. 1559-1569 ◽  
Author(s):  
S.G.R Brown ◽  
J.A Spittle ◽  
D.J Jarvis ◽  
R Walden-Bevan
Keyword(s):  
Liquid Flow ◽  
Numerical Determination ◽  
Dendritic Structures

The effect of back-melting on the continuity of crystallographic orientation and composition in HgZnTe

1992 ◽  
Vol 50 (2) ◽  
pp. 1696-1697
Author(s):  
H.J. Zuo ◽  
M.W. Price ◽  
R.D. Griffin ◽  
R.A. Andrews ◽  
G.M. Janowski
Keyword(s):  
Directional Solidification ◽  
Space Shuttle ◽  
Solidification Process ◽  
Space Experiment ◽  
Infrared Detection ◽  
Directionally Solidified ◽  
Crystallographic Defects ◽  
Semiconducting Alloys ◽  
Uniform Composition ◽  
Growth Experiments

The II-VI semiconducting alloys, such as mercury zinc telluride (MZT), have become the materials of choice for numerous infrared detection applications. However, compositional inhomogeneities and crystallographic imperfections adversly affect the performance of MZT infrared detectors. One source of imperfections in MZT is gravity-induced convection during directional solidification. Crystal growth experiments conducted in space should minimize gravity-induced convection and thereby the density of related crystallographic defects. The limited amount of time available during Space Shuttle experiments and the need for a sample of uniform composition requires the elimination of the initial composition transient which occurs in directionally solidified alloys. One method of eluding this initial transient involves directionally solidifying a portion of the sample and then quenching the remainder prior to the space experiment. During the space experiment, the MZT sample is back-melted to exactly the point at which directional solidification was stopped on earth. The directional solidification process then continues.

Interfacial structures of dissimilar materials joined by capacitor-discharge welding

1994 ◽  
Vol 52 ◽  
pp. 534-535
Author(s):  
C. P. Doğan ◽  
R. D. Wilson ◽  
J. A. Hawk
Keyword(s):  
Rapid Solidification ◽  
Fusion Zone ◽  
Dissimilar Materials ◽  
Solidification Process ◽  
Weld Interface ◽  
Capacitor Discharge ◽  
Fine Grained ◽  
Iron Aluminum ◽  
Conductive Ceramics ◽  
Capacitor Discharge Welding

Capacitor Discharge Welding is a rapid solidification technique for joining conductive materials that results in a narrow fusion zone and almost no heat affected zone. As a result, the microstructures and properties of the bulk materials are essentially continuous across the weld interface. During the joining process, one of the materials to be joined acts as the anode and the other acts as the cathode. The anode and cathode are brought together with a concomitant discharge of a capacitor bank, creating an arc which melts the materials at the joining surfaces and welds them together (Fig. 1). As the electrodes impact, the arc is extinguished, and the molten interface cools at rates that can exceed 106 K/s. This process results in reduced porosity in the fusion zone, a fine-grained weldment, and a reduced tendency for hot cracking.At the U.S. Bureau of Mines, we are currently examining the possibilities of using capacitor discharge welding to join dissimilar metals, metals to intermetallics, and metals to conductive ceramics. In this particular study, we will examine the microstructural characteristics of iron-aluminum welds in detail, focussing our attention primarily on interfaces produced during the rapid solidification process.

Vortex Precession in a Gas-Liquid Flow

2010 ◽  
Vol 41 (4) ◽  
pp. 465-478 ◽  
Author(s):  
S. I. Shtork ◽  
Sergei Alekseenko ◽  
V. L. Okulov ◽  
P. A. Kuibin
Keyword(s):  
Liquid Flow ◽  
Vortex Precession ◽  
Gas Liquid Flow
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