Design and Analysis of Key Components in the Nanoindentation and Scratch Test Device

Recatest—A Technique for Qualitative and Quantitative Assessment of Deferment and Degraded PVD Coatings and CVD Layers in the Deformed Area in the Scratch Test

Materials ◽

10.3390/ma14102625 ◽

2021 ◽

Vol 14 (10) ◽

pp. 2625

Author(s):

Piotr Domanowski ◽

Marek Betiuk

Keyword(s):

Scratch Test ◽

Metallographic Analysis ◽

Tool Steels ◽

Test Device ◽

Coating Structure ◽

Testing Technique ◽

Coating Materials ◽

Qualitative And Quantitative ◽

Quantitative Parameters

The purpose of the paper is to present a new Recatest testing technique which uses a series of abrasions within a scratch and its innovative application to describe selected quantitative parameters of locally, plastically deformed substrate and coating materials detected on the spherical microsection in the scratch test. The exposed material structures are subject to a metallographic analysis which allows for the determination of the quantitative parameters, which in turn allow for a description of the change in dynamics of the coating structure within the scratch area as a function of load. These parameters include scratch depth (hs), coating thickness (h1), flash height (hoc, hos), depth of intended material (hd), material depth under scratch (hcp), and material depth under coating (hdb). The paper also includes a description of the Recalo test device designed by the authors, which is used to make a series of spherical abrasion traces on the scratch surface. Recalo is dedicated to the Recatest technique. The analysed material was the CrN/CrCN/HS6-5-2, AlCrN -Alcrona-Balinit/D2 coatings deposited on tool steels.

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Effect of Stress and Relax Instructions on the Predictive Validity of a Test Device

Measurement and Evaluation in Guidance ◽

10.1080/00256307.1974.12022617 ◽

1974 ◽

Vol 7 (1) ◽

pp. 46-50 ◽

Cited By ~ 1

Author(s):

Bruce W. Hall ◽

T. Salvatore Tocco ◽

Larry S. Schwartz

Keyword(s):

Predictive Validity ◽

Test Device

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Development Path of Anthropomorphic Test Device with Chinese Physical Signs

Chinese Journal of Engineering Science ◽

10.15302/j-sscae-2019.03.022 ◽

2019 ◽

Vol 21 (3) ◽

pp. 103

Author(s):

Zhixin Liu ◽

Yongqiang Wu ◽

Weijie Ma

Keyword(s):

Test Device ◽

Development Path

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The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

MRS Proceedings ◽

10.1557/proc-766-e.3.5 ◽

2003 ◽

Vol 766 ◽

Author(s):

A. Sekiguchi ◽

J. Koike ◽

K. Ueoka ◽

J. Ye ◽

H. Okamura ◽

...

Keyword(s):

Thin Films ◽

Adhesion Strength ◽

Nitrogen Concentration ◽

Scratch Test ◽

Barrier Structure ◽

Barrier Layers ◽

Cu Metallization ◽

Microstructure Observation ◽

Sputter Deposited ◽

Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

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