Reduction of electromagnetic interference due to electric field coupling on printed circuit board

2001 ◽  
Author(s):  
Chun-ming, Angus Lee
Keyword(s):  
Electric Field ◽  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Field Coupling

Numerical simulation of EWOD on a printed circuit board for cleanroom-less digital fluidic manufacturing applications

2019 ◽  
Vol 38 (1) ◽  
pp. 119-137 ◽  
Author(s):  
Reza Hadjiaghaie Vafaie ◽  
Hossein Dehganpour ◽  
Abolfazl Moradpour
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electric Field ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Angle Distribution ◽  
Content Type ◽  
Electrowetting On Dielectric ◽  
Printed Circuit ◽  
Wide Range

Purpose Digital microfluidic devices have been demonstrated to have great potential for a wide range of applications. These devices need expensive photolithography process and clean room facilities, while printed circuit board (PCB) technology provides high configurability and at low cost. This study aims to investigate the mechanism of electrowetting-on-a-dielectric (EWOD) on PCB by solving the multiphysics interaction between fluid droplet and electric field. The performance of system will be improved by inducing an efficient electric field inside the droplet. Design/methodology/approach To induce an electric field inside the droplet on a PCB and change the initial contact angle, the mechanism of EWOD is studied based on energy minimization method and a set of simulations are carried out by considering multiphysics interaction between the fluid droplet and external electric field. The performance of EWOD on a PCB system is investigated using different electrode structures. Findings Surface tension plays an efficient role in smaller sizes and can be used to move and control a fluid droplet on a surface by changing the interfacial surface tension. EWOD on a PCB system is studied. and it revealed that any change in electric field affects the droplet contact angle and as a result droplet deformation and movement. The electrode pattern is an important parameter which could change the electric potential distribution inside the droplet. Array of electrodes with square, zigzag interdigitated and crescent shapes are studied to enhance the EWOD force on a PCB substrate. Based on the results, the radial shape of the crescent electrodes keeps almost the same actuated contact line, applies uniform force on the droplet periphery and prevents the droplet from large deformation. A droplet velocity of 0.6 mm/s is achieved by exciting the crescent electrodes at 315 V. Furthermore, the behavior of system is characterized for process parameters such as actuation voltage, dielectric constant of insulator layer, fluidic material properties and the resultant velocity and contact angle. The study of contact angle distribution and droplet motion revealed that it is helpful to generate EWOD mechanism on a PCB which does not need more complicated fabrication processes. Originality/value The ability to handle and manipulate the droplets is very important for chemistry on-chip analysis such as immunoassay chips. Furthermore, a PCB-based electrowetting-on-dielectric device is of high interest because it does not need cleanroom facilities and avoids additional high-cost fabrication processes. In the present research, the EWOD mechanism is studied on a PCB by using different electrode patterns.

scholarly journals Design and Study of a Wide-Band Printed Circuit Board Near-Field Probe

Electronics ◽  
2021 ◽  
Vol 10 (18) ◽  
pp. 2201 ◽  
Author(s):  
Pedro A. Martinez ◽  
Enrique A. Navarro ◽  
Jorge Victoria ◽  
Adrian Suarez ◽  
Jose Torres ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Transmission Loss ◽  
Near Field ◽  
Fem Simulation ◽  
Numerical Results ◽  
Circuit Board ◽  
Frequency Range ◽  
Printed Circuit

Magnetic near-field probes (NFP) represent a suitable tool to measure the magnetic field level from a small electromagnetic interference (EMI) source. This kind of antenna is useful as a magnetic field probe for pre-compliance EMC measurements or debugging tasks since the user can scan a printed circuit board (PCB) looking for locations with strong magnetic fields. When a strong H-field point is found, the designer should check the PCB layout and components placement in that area to detect if this could result in an EMI source. This contribution focuses on analyzing the performance of an easy to build and low-cost H-field NFP designed and manufactured using a standard PCB stack-up. Thereby, the frequency range and sensitivity of the NFP-PCB are analyzed through a Finite Element Method (FEM) simulation model that makes it possible to evaluate its sensibility and effective frequency range. The numerical results obtained with the FEM models are validated against measurements to verify the design and performance of our NFP. The FEM model reproduces the experimental procedure, which is used to evaluate the performance of the NFP in terms of sensitivity by means of the simulated near-field distribution. The NFP-PCB has almost a flat response from 180 MHz to 6 GHz, with an almost perfect concordance between numerical and experimental S21 results. The numerical results show an average transmission loss of −27.9 dB by considering the flat response bandwidth, whereas the experimental one is −29.7 dB. Finally, the designed NFP is compared to two high-quality commercial probes in order to analyze its performance.

Calculation and analysis of the model of electromagnetic interference on printed circuit board traces

2014 ◽  
Vol 26 (7) ◽  
pp. 73214
Author(s):  
王永峰 Wang Yongfeng ◽  
于成大 Yu Chengda ◽  
陈政新 Chen Zhengxin ◽  
李明 Li Ming
Keyword(s):  
Electromagnetic Interference ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Stitching equipotential metallization areas on the double-sided printed circuit board

2020 ◽  
Vol 30 (2) ◽  
pp. 55-61
Author(s):  
A. A. Krasilnikov ◽  
S. Yu. Luzin ◽  
M. S. Luzin ◽  
S. A. Sorokin
Keyword(s):  
Thermal Resistance ◽  
Iterative Algorithm ◽  
Electromagnetic Interference ◽  
High Speed ◽  
Printed Circuit Board ◽  
Heat Removal ◽  
Circuit Board ◽  
Current Loop ◽  
Printed Circuit ◽  
Intersection Area

The linking (stitching) of equipotential metallization areas located on different layers of the printed circuit board is carried out using layer-to-layer vias. The purposes can be different, e. g.: heat removal from heat-loaded components, reduction of the thermal resistance of the board (reducing the risk of warping the board when exposed to thermal loads); reduction of the return current loop of high-speed signals, including differential ones; reduction of the level of electromagnetic interference. The paper reviews the problem of connecting the maximum number of unconnected copper islands on the fully routed twolayer board, which has ground planes on both sides with the help of vias. An iterative algorithm is proposed based on determining the area of the projections of isolated islands with the metallization area on the opposite sideboard, if a via can be placed in the intersection area. The algorithm guarantees the connection between the maximum number of islands.

scholarly journals Shielding Elektromagnetik Tembaga dari Proses Elektrolisis Air Limbah Industri Printed Circuit Board

2020 ◽  
Vol 10 (1) ◽  
pp. 9
Author(s):  
Agung Yanuar Wirapraja ◽  
Handaru Bowo Cahyono ◽  
Mohamad Marhaendra Ali
Keyword(s):  
Electromagnetic Interference ◽  
Industrial Wastewater ◽  
Printed Circuit Board ◽  
Negative Impact ◽  
Electromagnetic Shielding ◽  
Circuit Board ◽  
Radiation Emission ◽  
Electronic Products ◽  
Printed Circuit ◽  
Antenna Polarization

Some electronic products have high electromagnetic interference so that it gives a negative impact on the electronic devices around it. The use of electromagnetic shielding is a solution to reduce the value of electromagnetic radiation interference from electronic products. The research conducted includes the manufacture of electromagnetic shielding from copper material resulting from the electrolysis process of PCB (Printed Circuit Board) industrial wastewater and analyzing the effect of electromagnetic shielding from copper waste on the value of radiation emission. Electromagnetic shielding is made of vinyl which is coated with copper as a result of the electrolysis of PCB industrial wastewater. The measurement results show that electromagnetic shielding from copper waste can reduce radiation emissions. The use of electromagnetic shielding from copper waste is effective at frequencies from 250 to 350 MHz with a decrease in the quasi-peak value of 38.02 dB. The measurements with horizontal antenna polarization show that the margin of radiation emission value is higher comparated to vertical antenna polarization.Sebagian produk elektronika memiliki gangguan interferensi elektromagnetik yang tinggi, sehingga berdampak kurang baik terhadap perangkat elektronika di sekitarnya. Pemanfaatan shielding elektromagnetik menjadi solusi untuk mengurangi nilai gangguan radiasi elektromagnetik yang dimiliki oleh produk elektronika. Penelitian yang dilakukan meliputi pembuatan shielding elektromagnetik dari bahan tembaga hasil dari proses elektrolisis limbah industri PCB (Printed Circuit Board) dan melakukan analisa pengaruh shielding elektromagnetik dari limbah tembaga terhadap nilai emisi radiasi. Shielding elektromagnetik terbuat dari bahan vinyl yang dilapisi dengan tembaga hasil elektrolisis limbah cair industri PCB. Hasil pengukuran menunjukkan bahwa shielding elektromagnetik dari limbah tembaga dapat menurunkan emisi radiasi. Penggunaan shielding elektromagnetik dari limbah tembaga efektif di frekuensi 250 – 350 MHz dengan penurunan nilai quasi-peak sebesar 38,02 dB. Pada pengukuran dengan polarisasi antena horisontal, margin nilai emisi radiasi lebih tinggi jika dibandingkan dengan polarisasi antena vertikal. Kata Kunci: Shielding elektromagnetik, Emisi radiasi, Tembaga, PCB

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