scholarly journals Comparative Study of Different Low Power Design Techniques for Reduction of Leakage Power in CMOS VLSI Circuits

2013 ◽  
Vol 70 (11) ◽  
pp. 16-24
Author(s):  
P. S.Aswale ◽  
S. S. Chopade
VLSI Design ◽  
2001 ◽  
Vol 12 (3) ◽  
pp. 317-331
Author(s):  
Alvar Dean ◽  
David Garrett ◽  
Mircea R. Stan ◽  
Sebastian Ventrone

A semicustom ASIC design methodology is used to develop a low power DSP core for mobile (battery powered) applications. Different low power design techniques are used, including dual voltage, low power library elements, accurate power reporting, pseudomicrocode, transition-once logic, clock gating, and others.


2021 ◽  
Vol 2089 (1) ◽  
pp. 012080
Author(s):  
M. Srinivas ◽  
K.V. Daya Sagar

Abstract Currently, energy consumption in the digital circuit is a key design parameter for emerging mobile products. The principal cause of the power dissipation during idle mode is leakage currents, which are rising dramatically. Sub-threshold leakage is increased by the scaling of threshold voltage when gate current leakage increases because oxide thickness is scaled. With rising demands for mobile devices, leakage energy consumption has received even greater attention. Since a mobile device spends most of its time in standby mode, leakage power savings need to prolong the battery life. That is why low power has become a significant factor in CMOS circuit design. The required design and simulation of an AND gate with the BSIM4 MOS parameter model at 27 0C, supply voltage of 0,70V with CMOS technology of 65nm are the validation of the suitability of the proposed circuit technology. AND simulation. The performance parameters for the two AND input gate are compared with the current MTCMOS and SCCMOS techniques, such as sub-threshold leakage power dissipations in active and standby modes, the dynamic dissipation, and propagation period. The proposed hybrid super cutoff complete stack technique compared to the current MTCMOS technology shows a reduction in sub-threshold dissipation power dissipation by 3. 50x and 1.15x in standby modes and active modes respectively. The hybrid surface-cutting technique also shows savings of 2,50 and 1,04 in power dissipation at the sub-threshold in standby modes and active modes compared with the existing SCCMOS Technique.


Author(s):  
Somesh Rajain ◽  
Chetan Shingala ◽  
Ekata Mehul

The large emission of Carbon dioxide (CO2) is not only affecting our ecology but also affecting human life. In schools, offices, factory and crowded railway/bus stations i.e crowded places with insufficient ventilations CO2 affects human life most. In a closed environment like school, If CO2 level starts raising above 700 parts per million (ppm) people will feel objectionable body odors and as it increase further people will feel very uncomfortable, dizzy and have headache etc. Our goal is to reduce CO2 emission and lower global warming. In Semiconductor Industry as the digital technology grows, the functionality of our electronics devices (For example: - Mobile phone, PC’s, home appliances etc) is constantly improves and mean while the demand for electronic devices to be more environment friendly is increasing. So we have to design systems with Low power consumption to curtail down green house gas emission as well as low power design are also a requirement of today’s market. The usage of mobile device in all kinds of applications is increasing day by day. These applications and corresponding devices also have their power requirements. The demand for mobile consumer device has made the power management the number one consideration in today‘s system design. To increase battery life, system chip designer needs to adopt an aggressive power management technique which includes multi voltage Design Island, power gating, dynamic voltage, frequency scaling, clock gating etc in the system. Adding all these greatly complicates the verification for the chip. Normally the designer neglects the implementation of power saving techniques due to the tradeoff between power reduction and verification costs. The costs become more important in terms of business, which leads to more power consumption. Those details can still be implemented provided we use right kind of tools & techniques that are also combined with design experience. In this chapter the focus is to firstly describe low power design techniques, its verification challenges and its solutions followed by the case study. It also guides for the selection of programmable device & RTL Core design criteria. To make green electronics devices we have to design system with low power design techniques.


2018 ◽  
Vol 7 (3.1) ◽  
pp. 34
Author(s):  
Vithyalakshmi. N ◽  
Nagarajan P ◽  
Ashok Kumar.N ◽  
Vinoth. G.S

Low power design is a foremost challenging issue in recent applications like mobile phones and portable devices. Advances in VLSI technology have enabled the realization of complicated circuits in single chip, reducing system size and power utilization. In low power VLSI design energy dissipation has to be more significant. So to minimize the power consumption of circuits various power components and their effects must be identified. Dynamic power is the major energy dissipation in micro power circuits. Bus transition activity is the major source of dynamic power consumption in low power VLSI circuits. The dynamic power of any complex circuits cannot be estimated by the simple calculations. Therefore this paper review different encoding schemes for reduction of transition activity and power dissipation. 


2012 ◽  
Vol 55 (8) ◽  
pp. 42-48 ◽  
Author(s):  
Pushpa Saini ◽  
Rajesh Mehra

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