Role of Grain-Boundary Precipitates and Solute-Depleted Zone on the Intergranular Corrosion of Aluminum Alloy 7150

CORROSION ◽  
2002 ◽  
Vol 58 (8) ◽  
pp. 687-697 ◽  
Author(s):  
T. Ramgopal ◽  
P. I. Gouma ◽  
G. S. Frankel
Author(s):  
Vasile Hotea ◽  

In this work, has been performed the characteristics and susceptibility to intergranular corrosion of high strength alloy of AA2024-T3 in alkaline media. Intergranular corrosion can occur randomly over the entire surface of an alloy, but corrosion is limited to the immediate area of the grain boundary and is often not apparent by simple visualization. It can be an important source of limiting the life of the aircraft body where alloys from the 2xxx series are used, which is why they are systematically subjected to intergranular corrosion tests in dedicated laboratories.


2010 ◽  
Vol 138 ◽  
pp. 1-6 ◽  
Author(s):  
M. Bobby Kannan ◽  
V.S. Raja

This paper brings out the developments on heat-treatment and alloying to improve the stress corrosion cracking (SCC) behavior of 7010 Al-alloy. The role of microstructures including the grain boundary precipitates and recystallized grains and the relation of intergranular corrosion (IGC) on the SCC behavior of 7010 Al-alloy have been discussed.


2006 ◽  
Vol 519-521 ◽  
pp. 667-672 ◽  
Author(s):  
Magnus Hurlen Larsen ◽  
John Charles Walmsley ◽  
Otto Lunder ◽  
Kemal Nisancioglu

Intergranular corrosion (IGC) of model alloys in the 6000-series, with and without 0.2 wt% Cu, was studied using an accelerated corrosion test (BS ISO 11846 B), FE-SEM and FE-TEM. Low Cu alloys (0.02wt%) did not exhibit IGC even though they contained excess Si. The high-Cu, naturally aged material (T4) was susceptible to severe superficial etching. In the underaged state (below peak strength), the Cu-containing material was highly susceptible to IGC. Materials aged to peak strength (T6) or overaged were only slightly susceptible to IGC, with localized, shallow attacks. FE-TEM investigation of the underaged material revealed scattered, small AlMgSiCu-type precipitates, as well as a Cu-enriched film along the grain boundaries. The overaged material showed more extensive, coarse grain boundary precipitation. However, the Cu-enriched film was still present at localized sites. The reduced susceptibility to IGC upon artificial ageing was attributed to breaking of the continuity of the grain boundary film. The possible role of matrix precipitation is also discussed.


Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


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