Calculation of Heat Transfer Coefficients Across an Electronic Box Bare Interface Using a Finite Element Approach

1996 ◽  
Author(s):  
John W. Welch ◽  
Brian T. Hamada
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Transfer Coefficients ◽  
Finite Element Approach ◽  
Heat Transfer Coefficients ◽  
Element Approach

Experimental Platforms and Finite Element Analysis on Hot Stamping Processes

2014 ◽  
Vol 1063 ◽  
pp. 334-338 ◽  
Author(s):  
Tzu Hao Hung ◽  
Heng Kuang Tsai ◽  
Fuh Kuo Chen ◽  
Ping Kun Lee
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Process Design ◽  
Hot Stamping ◽  
Boron Steel ◽  
Transfer Coefficients ◽  
Element Analysis ◽  
Heat Transfer Coefficients ◽  
The Finite Element Analysis

Due to the complexity of hot stamping mechanism, including the coupling of material formability, thermal interaction and metallurgical microstructure, it makes the process design more difficult even with the aid of the finite element analysis. In the present study, the experimental platforms were developed to measure and derive the friction and heat transfer coefficients, respectively. The experiments at various elevated temperatures and contact pressures were conducted and the friction coefficients and heat transfer coefficients were obtained. A finite element model was also established with the experimental data and the material properties of the boron steel calculated from the JMatPro software. The finite element simulations for the hot stamping forming of an automotive door beam, including transportation analysis, hot forming analysis and die quenching analysis were then performed to examine the forming properties of the door beam. The validation of the finite element results by the production part confirms the efficiency and accuracy of the developed experimental platforms and the finite element analysis for the process design of hot stamping.

Squeal and Thermal Analysis of Automobile Disc Brake Rotors

2015 ◽  
Vol 764-765 ◽  
pp. 369-373
Author(s):  
Wei Hsin Gau ◽  
Kun Nan Chen ◽  
Chin Yuan Hung
Keyword(s):  
Heat Transfer ◽  
Thermal Analysis ◽  
Finite Element ◽  
Aluminum Alloy ◽  
Cast Iron ◽  
Cfd Simulation ◽  
Transfer Coefficients ◽  
Element Analysis ◽  
Heat Transfer Coefficients ◽  
Brake Rotors

The brakes of an automobile are among the most critical components regarding the safety features, and disc brakes are the most common type used in passenger vehicles. In this research, the squeal phenomena of a swirl-vent brake rotor and the thermal analysis of two straight-vent brake rotors, made of cast-iron and aluminum-alloy, are investigated. For the squeal analysis, finite element models are created and analyzed using a prestressed modal analysis with complex eigen-solutions. For the thermal analysis, heat transfer coefficients on the surfaces of a rotor as functions of time are first estimated by CFD simulation, and then imported to a thermal analysis program as the boundary condition. Finally, the temperature distribution of the rotor can be calculated by finite element analysis. The simulation results show that vortices will arise in the vented passages of straight-vent rotors, which means less heat carried away and lower heat transfer coefficients. The swirl-vent brake design is clearly better for thermal ventilation. Furthermore, under the same condition, aluminum-alloy rotors exhibit more uniform temperature distributions with smaller temperature gradients than cast-iron rotors do.

Thermal Reliability Design and Optimization for Multilayer Composite Electronic Boards

2005 ◽  
Author(s):  
Amir Khalilollahi ◽  
Russell L. Warley ◽  
Oladipo Onipede
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Stress Intensity ◽  
Finite Element Model ◽  
Element Model ◽  
Fe Model ◽  
Transfer Coefficients ◽  
Thermal Reliability ◽  
Irreversible Damage ◽  
Heat Transfer Coefficients

Boards made of composites are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and studied for the models possessing two and there laminates with different fiber orientations, and inter-fiber angles. Appreciable differences in values of max stress intensity were observed as the fiber orientation and inter-fiber angle changed. The angular parameters in this study were guided by experimental design (DOE) concepts leading to a metamodel of the stress intensity in the board. The optimum design variables found by the equations of the metamodel.

Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards

1989 ◽  
Vol 111 (2) ◽  
pp. 129-134 ◽  
Author(s):  
C. Rajakumar ◽  
D. Johnson
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Convection Heat Transfer ◽  
Circuit Board ◽  
Convection Heat ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Heating Surfaces ◽  
Free Convection Heat ◽  
Microelectronic Components

A numerical simulation of the buoyancy-induced flow around microelectronic components mounted on a circuit board has been performed using the finite element method. The circuit board is modeled by a vertical plate on which rectangular strip heating surfaces are mounted. Computations have been performed in two-dimensional plane applying a simplifying assumption that the circuit board and the strip heating surfaces are infinitely long. The Navier-Stokes, the flow continuity and the energy equations for laminar flow have been considered in the finite element discretizations. Results of the computations are presented in the form of temperature contour plots and velocity vector plots in the flow field. The convection heat transfer coefficients at the surface of the microelectronic components are presented as a function of their height. The convection coefficients computed have been compared with experimental correlations of free convection heat transfer found in the literature.

Numerical Simulation on the Temperature Field of Steel 1045 Quenched by Different Hardening Media

2013 ◽  
Vol 444-445 ◽  
pp. 1222-1228
Author(s):  
Jian Bin Xie ◽  
Chang Chang Wu ◽  
Jing Fan ◽  
Miao Fu ◽  
Deng Feng Hu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Temperature Fields ◽  
Cooling Curves ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Heat Transfer Theory ◽  
Quenching Process ◽  
Estimate Method

Based on the experimental measured cooling curves and the boiling heat transfer theory, the inverse problem of nonlinear heat conduct equation for Steel 1045 quenched by different hardening media was established by functional analysis and finite element method, and the surface heat-transfer coefficients in continuous cooling during quenching were calculated by nonlinear estimate method. Then the constitutive model of Steel 1045 during quenching was established subsequently. Finally, the temperature field of Steel 1045 cylinder quenched by different hardening media was simulated by Finite Element Methods (FEM). Results show that the calculated temperature fields agree with the practical quenching process.

Modeling of Heat Transfer in Rotary Furnaces Using Finite Element Approach

2018 ◽  
pp. 20160100
Author(s):  
K. J. Akinluwade ◽  
F. P. Ibitoye ◽  
D. A. Isadare ◽  
M. O. Adeoye ◽  
A. R. Adetunji
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Approach ◽  
Element Approach
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