Encoders, Switches and Other Electronic Components Utilizing New Thick Film Material Technology

1991 ◽  
Author(s):  
Richard E. Riley ◽  
Daniel R. Sparks
Keyword(s):  
Thick Film ◽  
Film Material ◽  
Electronic Components ◽  
Material Technology

Design and Fabrication of an LTCC Structure for a Microceramic Combustor

2012 ◽  
Vol 9 (3) ◽  
pp. 120-125 ◽  
Author(s):  
Darko Belavic ◽  
Marko Hrovat ◽  
Gregor Dolanc ◽  
Kostja Makarovic ◽  
Marina Santo Zarnik
Keyword(s):  
Thick Film ◽  
High Pressures ◽  
Three Dimensional ◽  
Temperature Sensors ◽  
Ceramic Technology ◽  
Electronic Components ◽  
Buried Structures ◽  
Flow Rates ◽  
Points Of View ◽  
Harsh Conditions

Advanced microsystems or macrosystems are in some cases made with multilayer ceramic technology. Low-temperature cofired ceramic (LTCC) technology is considered to be one of the more suitable technologies for the fabrication of ceramic microsystems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical microcombustor through a burning process, while the accompanying high temperatures and, frequently, high pressures, impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal, and chemical points of view, but also with respect to the mechanical strength. The combustor device was prepared by lamination of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight microburners realized as buried cavities. In the burners, a platinum-based catalyst was deposited to assist the oxidation, that is, the burning, of the methanol with the air. Thick-film, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 mL/h to 5 mL/h) and air (7 L/h to 15 L/h). The temperatures obtained were between 250°C and 450°C.

scholarly journals Stability Observations and Surface Analysis of Air Fired Nickel Thick Film Conductors

1985 ◽  
Vol 11 (4) ◽  
pp. 291-297 ◽  
Author(s):  
R. B. Pranchov ◽  
D. S. Campbell
Keyword(s):  
Thick Film ◽  
Surface Analysis ◽  
Glass Phase ◽  
Film Surface ◽  
Peak Temperature ◽  
Film Material ◽  
Film Instability ◽  
Isotropic Distribution ◽  
Possible Cause ◽  
High Instability

The results from an investigation of the properties of air fired Nickel thick film produced with conductive paste ESL 2554 on 96% Al2O3substrates are described. The analysis of the possible causes of instability of this thick film material has been done using the methods of surface analysis. The picture of the film surface structure obtained as a result of surface analysis shows a non-isotropic distribution of the metal and glass phase. For a firing peak temperature of 650℃ there is little nickel present at the film surface, and this could be the main cause of the high instability and low adhesion observed. To obtain a stable film the maximum firing peak temperature has been established at 580℃. This has been confirmed by comparing the surface analysis results from films prepared at 650℃ and 580℃ peak temperatures.The surface analysis of the substrate shows the presence of Silicon which may be considered as another possible cause of film instability.

Co-Firing Technology for Buried Resistors

2003 ◽  
Author(s):  
G. Yadagiri ◽  
K. K. Goswami ◽  
K. S. Gurumurthy ◽  
Satyam ◽  
K. N. Shankara
Keyword(s):  
Thick Film ◽  
Firing Process ◽  
Electronic Systems ◽  
Electronic Components ◽  
Sequential Processing ◽  
Intermediate Layers ◽  
Firing Technology ◽  
And Performance ◽  
Embedded Resistors ◽  
Made In

The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important technologies adopted in the miniaturization of electronic systems. Normally only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the intermediate layers using conventional thick film materials using co-firing process has been examined in this paper. Normally multilayer structures are fabricated by printing / drying / firing of each layer separately starting from the bottom most layer (sequential processing). In this process the bottom layers undergo sintering many times. To avoid many firing cycles and to save power and processing time, a study is taken up to examine the effects of co-firing on the multilayer structure with embedded resistors. The results of the study are presented in this paper.

New thick-film material for piezoresistive sensors

2001 ◽  
Vol 95 (1) ◽  
pp. 39-45 ◽  
Author(s):  
S. Tankiewicz ◽  
B. Morten ◽  
M. Prudenziati ◽  
L.J. Golonka
Keyword(s):  
Thick Film ◽  
Film Material ◽  
Piezoresistive Sensors

Piezoelectric Paint: Thick-Film Sensors for Structural Monitoring of Shock and Vibration

Volume 3 ◽  
2004 ◽  
Author(s):  
J. M. Hale
Keyword(s):  
Thick Film ◽  
Dynamic Range ◽  
Strain Sensors ◽  
Structural Monitoring ◽  
Dynamic Strain ◽  
Environmental Damage ◽  
Film Material ◽  
Significant Deterioration ◽  
Vibration Sensors ◽  
Paint Spray

This paper describes dynamic strain sensors made using piezoelectric paint, a novel piezoelectric thick-film material which can be deposited using conventional paint spray equipment. The morphology of piezoelectric paint is described briefly, followed by a fuller description of the characteristics of thick-film vibration sensors made using it. It is shown that they have adequate properties (dynamic range and bandwidth) for use in structural monitoring applications, and that they are robust against environmental damage. Finally, a field trial is described in which a sensor has survived for three years without significant deterioration in a typical location on a bridge.

scholarly journals Comparison of Enameled Steel Substrate Properties for Thick Film Use

1980 ◽  
Vol 7 (1-3) ◽  
pp. 55-62 ◽  
Author(s):  
S. J. Stein ◽  
C. Huang ◽  
A. S. Gelb
Keyword(s):  
Thick Film ◽  
Steel Substrate ◽  
Soda Lime ◽  
Dissipation Factor ◽  
Soda Lime Glass ◽  
Film Material ◽  
Insulation Resistance ◽  
Large Area ◽  
Substrate Properties ◽  
Steel Substrates

Porcelain enameled steels have had a long history of industrial, structural and related applications. Recent interest in such materials has centered on electrical uses as a substrate for hybrid circuits, additive printed wiring, and packaging. A study of some of the critical properties of available enameled steels was undertaken.Five types of enameled steel substrates from three manufacturers were tested. The electrical properties studied included dielectric constant, dissipation factor, voltage breakdown, surface and bulk insulation resistance. The effect of humidity on the insulation resistance of the enamel coatings themselves was compared. The influence of the thermal conductivity of the substrates was also examined.The properties of a thick film resistor system was determined on the various enamel steel substrates. The properties tested included resistivity and TCR firing sensitivity.The effect of the type of substrate on the properties of a selection of thick film conductors was determined. Conductivity and gold and aluminum wire bond strength were compared on the various substrates.The dielectric properties of a multilayer/crossover dielectric thick film material were compared among 96% alumina, soda-lime glass and the various enameled steel substrates.Many individual differences between the enameled steel substrates were found. However, all of the substrates could be utilized to produce satisfactory thick film circuits when the proper choice of thick film materials was made.Continuing changes, improvements and additional sources of supply are expected to overcome some of the present shortcomings. These should enhance the use of such substrates for large area uses and lower cost applications.

scholarly journals Advances in Low Cost Silver-Containing Thick Film Conductors

1981 ◽  
Vol 9 (1) ◽  
pp. 67-85 ◽  
Author(s):  
Barry E. Taylor ◽  
John J. Felten ◽  
Samuel J. Horowitz ◽  
John R. Larry ◽  
Richard M. Rosenberg
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Thick Film ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
High Volume ◽  
Film Material ◽  
Advantages And Disadvantages ◽  
Thick Film Technology

Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al2O3substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃.

Measurement of Complex Permeability of Thick Film Materials in the 0.1 GHz~0.6GHz Band

2020 ◽  
Vol 1001 ◽  
pp. 161-168
Author(s):  
Yu Ling Yuan ◽  
Di Fei Liang ◽  
Wei Jia Li
Keyword(s):  
Thick Film ◽  
Empirical Formula ◽  
Magnetic Parameter ◽  
Low Frequency ◽  
Impedance Analysis ◽  
Complex Permeability ◽  
Film Material ◽  
Strip Line ◽  
Hard Materials ◽  
Parameter Test

The existing low-frequency magnetic parameter test is mainly based on impedance analysis,Its sample needs to be prepared into a ring,the hard materials are difficult to process into rings for testing. Small piece of material cannot be tested using impedance analysis because it is too small to be cut into a ring for testing. In this paper, the principle of impedance analysis and the basic theory of strip line be used, an empirical formula for the complex permeability of the magnetic bulk thick film material in the 0.1Ghz~0.6GHz frequency band is obtained through design and test by design simulation and physical fixture, it makes the testing of the complex permeability of thick film materials easier due to it avoid damage and ring cutting before testing.

An additive method to fabricate conductive lines and electronic components directly by laser microcladding electronic materials

2009 ◽  
Vol 224 (5) ◽  
pp. 1087-1098 ◽  
Author(s):  
X Zeng ◽  
Z Cai ◽  
X Li
Keyword(s):  
Thick Film ◽  
Computer Aided Design ◽  
High Speed ◽  
Electronic Materials ◽  
Functional Materials ◽  
Direct Write ◽  
Electronic Components ◽  
Material Deposition ◽  
Computer Aided ◽  
Cad Cam

In this article, a laser direct-write method to fabricate conductive lines and electronic components on insulating boards by using laser microcladding electronic materials is reported. A workstation for implementing this direct-write method was developed, which integrated material deposition (micropen) and laser processing on a single machine. With the computer-aided design/computer-aided manufacturing (CAD/CAM) capability of the workstation, conductive lines, resistors, capacitors, inductors, and thick-film sensors with different patterns were fabricated successfully by this technique in air without mask and with high deposition rates. The minimum widths of the conductive lines and other functional materials were much less than those obtained by the conventional screen printing method. The experimental results demonstrated that passive components and thick-film sensors made by this method have the same properties as those made by conventional thick-film methods, whereas thick films fabricated by this method have much lower widths than those fabricated by the conventional thick-film method. This technique provides a novel method to fabricate the conductive lines and electronic components with high precision and high speed.

Sign in / Sign up

Export Citation Format

Share Document