Effect of Coating Time on the Performance of Electroless Nickel Coated Steel

2011 ◽  
Author(s):  
Raj Rajendran ◽  
Tharanipathy Venkatesan ◽  
Rasu Elansezhian
Keyword(s):  
Electroless Nickel ◽  
Coated Steel ◽  
Coating Time

scholarly journals The Corrosion Behavior of Electroless Nickel-Coated Steel in Alkaline Solutions

2009 ◽  
Vol 27 (3) ◽  
pp. 269-278 ◽  
Author(s):  
Miguel Sánchez ◽  
Henry Orozco ◽  
Orlando Pérez
Keyword(s):  
Corrosion Behavior ◽  
Electroless Nickel ◽  
Alkaline Solutions ◽  
Coated Steel

scholarly journals The Heat Treatment effect of Nickel-coated Steel Plate Substrate by Electroless Plating on Hardness Test

2018 ◽  
Vol 7 (4.33) ◽  
pp. 201
Author(s):  
Marisa Hirary ◽  
Aditianto Ramelan ◽  
. .
Keyword(s):  
Heat Treatment ◽  
Steel Plate ◽  
Surface Hardness ◽  
Hardness Test ◽  
Electroless Nickel ◽  
Coated Steel ◽  
Electroless Nickel Plating ◽  
Chemical Solution ◽  
Result Show ◽  
Main Component

The present study was aimed to analyze the effect of heat treatment on phase change of thin layer of nickel on steel plate substrate. The coating process was electroless plated using chemical solution. This work requires nickel solution as the main component of coating. Substrate was coated by electroless nickel plating at pH 7.5 and temperature was 85 ℃ for 100 minutes with heat treatment for 30 minutes at temperature are 320 ℃ and 340 ℃. Furthermore, the substrate will be analyzed with metallography method to obtain visualization of thickness on plate surface. The result show that the layer on steel surface has a uniform thickness. Based on the hardness test, the heated plated resulting the better performance compared with the non-heated one. Surface hardness increased from 134VHN to 646VHN with a coating thickness of 17.49μm and a XRD characterization showed a broadened Ni peak. After heat treatment at temperature are 320℃ and 340℃, the surface hardness increased up to 851VHN and 1020VHN.  

TiN and CrN PVD coatings on electroless nickel-coated steel substrates

1993 ◽  
Vol 60 (1-3) ◽  
pp. 474-479 ◽  
Author(s):  
A. Leyland ◽  
M. Bin-Sudin ◽  
A.S. James ◽  
M.R. Kalantary ◽  
P.B. Wells ◽  
...  
Keyword(s):  
Electroless Nickel ◽  
Coated Steel ◽  
Pvd Coatings ◽  
Steel Substrates

Analysis of electroless nickel thin films

1991 ◽  
Vol 49 ◽  
pp. 510-511 ◽  
Author(s):  
C. W. Price ◽  
E. F. Lindsey
Keyword(s):  
Thin Films ◽  
Inertial Confinement Fusion ◽  
Electroless Nickel ◽  
Inertial Confinement ◽  
Plating Bath ◽  
X Ray ◽  
Nickel Thin Films ◽  
Nickel Deposits ◽  
Confinement Fusion ◽  
Thickness Measurements

Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.

ENPLATE NI-423

Alloy Digest ◽  
1986 ◽  
Vol 35 (11) ◽  
Keyword(s):  
Wear Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
High Speed ◽  
Chemical Reduction ◽  
Electronic Devices ◽  
Electroless Nickel ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Phosphorus Alloy

Abstract ENPLATE NI-423 is a nickel-phosphorus alloy deposited by chemical reduction without electric current. It is deposited by a stable, relatively high-speed functional electroless nickel process that produces a low-stress coating with good ductility and excellent resistance to corrosion. Its many uses include equipment for chemicals and food, aerospace components, molds and electronic devices. This datasheet provides information on composition, physical properties, and hardness. It also includes information on corrosion and wear resistance as well as heat treating, machining, joining, and surface treatment. Filing Code: Ni-343. Producer or source: Enthone Inc..

ELECTROLESS NICKEL

Alloy Digest ◽  
1986 ◽  
Vol 35 (4) ◽  
Keyword(s):  
Nickel Coating ◽  
Chemical Reduction ◽  
Electroless Nickel ◽  
Heat Treating ◽  
Corrosion And Wear ◽  
Sodium Hypophosphite ◽  
Work Piece ◽  
Nickel Ions ◽  
Continuous Contact ◽  
Chemical Corporation

Abstract ELECTROLESS NICKEL is a nickel coating deposited by chemical reduction of nickel ions. The most widely used reducing agent is sodium hypophosphite. The thickness of the deposited coating is uniform over all areas of the work-piece that are in continuous contact with fresh plating solution. The process is applicable to a wide variety of metal and nonmetal substrates. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as heat treating and joining. Filing Code: Ni-332. Producer or source: Occidental Chemical Corporation.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

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