Comparative Analysis of Thermal Management Architectures to Address Evolving Thermal Requirements of Aircraft Systems

Author(s):  
Joseph Homitz ◽  
Robert P. Scaringe ◽  
Gregory S. Cole ◽  
Andy Fleming ◽  
Travis Michalak
2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Bin Sun ◽  
Xingyi Huang

AbstractWith the trend of integration, miniaturization, and increasing power density of stretchable electronic devices, real-time thermal dissipation is becoming crucial. Seeking materials and/or structures with advanced thermal management for stretchable electronics becomes an urgent issue. For passive thermal management, the traditional thermal interfacial materials (TIMs) with flexibility cannot meet the demand of stretchable electronics, because stretchable devices are usually required to experience a large scale of bending, twisting, stretching, and so on. The main challenge facing thermal management for stretchable electronics is how to maintain stable thermal conductance under large deformation. Here, we examine the development of materials and structures available in this field. We also propose a comparative analysis of the existing challenges and provide possible solutions for the thermal management of stretchable electronics in the future.


Author(s):  
Kawthar Kasim ◽  
Arun Muley ◽  
Michael Stoia ◽  
Foluso Ladeinde

Aerospace system efficiency improvement and capacity growth has fueled demand for innovative, affordable and scalable thermal management technologies. Recent advancements in additive manufacturing (AM) and materials has extended the thermal design space for heat exchangers, cold plates, heat sinks, and heat pipes. Novel heat transfer enhancement techniques, along with design and system interface innovations, offer attractive cooling solutions for use in numerous aircraft systems. These advances are becoming increasingly relevant in aircraft systems as customers are demanding the use of air-cooling instead of liquid-cooling with minimal impact on overall energy conversion efficiency, installed volume and weight. This paper provides an overview of Boeing-led advances in analysis, design, fabrication and testing of next generation heat transfer devices. A case study is presented to provide insight into a methodology for selection of heat transfer surfaces and design optimization for an air-to-air heat exchanger. Design considerations are presented for additive manufacturing of the thermal management devices using a range of high performance materials including aluminum, titanium, stainless steel, and conductive polymer composites.


2007 ◽  
Vol 177 (4S) ◽  
pp. 398-398
Author(s):  
Luis H. Braga ◽  
Joao L. Pippi Salle ◽  
Sumit Dave ◽  
Sean Skeldon ◽  
Armando J. Lorenzo ◽  
...  
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