In-Situ Observation of Elastoplastic Fatigue Fracture Behavior for Aluminum Cylinder Block Using Thermoelastic IR Thermograph

2005 ◽  
Author(s):  
Hajime Yasui ◽  
Yuji Yamamoto ◽  
Yasufumi Asada ◽  
Kazunari Takenaka
Metals ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 1007
Author(s):  
Hao Yang ◽  
Jishen Jiang ◽  
Zhuozheng Wang ◽  
Xianfeng Ma ◽  
Jiajun Tu ◽  
...  

The fatigue fracture mechanism of a nickel-based single crystal (NBSC) superalloy with recrystallized grains was studied at 550 °C by in situ observation with a scanning electron microscope (SEM) for the first time. Multiple crack initiations associated with recrystallized grain boundaries and carbides were observed. By analysis of the slip traces and crack propagation planes, the operated slip systems were identified to be octahedral for both single crystal substrate and recrystallized grains. Distinct crystallographic fractures dominated, accompanied by recrystallized grain boundary associated crack initiations. This is different from the widely reported solely intergranular cracking at high temperature. Fatigue crack growth rate curves showed evident fluctuation, due to the interaction of fatigue cracks with local microstructures and the crack coalescence mechanism. Both the recrystallized grains and the competition between different slip systems were responsible for the deceleration and acceleration of fatigue microstructurally small crack behavior.


2005 ◽  
Vol 241 (1-2) ◽  
pp. 68-74 ◽  
Author(s):  
S. Ii ◽  
C. Iwamoto ◽  
K. Matsunaga ◽  
T. Yamamoto ◽  
Y. Ikuhara

2006 ◽  
Vol 129 (2) ◽  
pp. 195-204 ◽  
Author(s):  
J. Liang ◽  
N. Dariavach ◽  
P. Callahan ◽  
D. Shangguan

Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated three-dimensional (3D) time-dependent nonlinear finite-element stress and strain analyses for the life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn3.8Ag0.7CuPb-free alloy and Sn–Pb eutectic alloy was investigated with thin-walled specimens using a biaxial servo-controlled tension–torsion material testing system, with solder alloys subjected to a variety of complex load conditions: pure shearing at strain rates between 6.7×10−7∕s and 1.3×10−1∕s, creep at temperatures ranging from room temperature up to 125°C, and cyclic loading with frequencies of 0.001Hz to 3Hz. Biaxial stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn3.8Ag0.7Cu and Sn–Pb eutectic solder. Fractography of fatigue tested samples was also conducted to determine possible fatigue failure mechanisms.


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