Corrosion Resistance of Trivalent Chromate Film by Difference of Plating Bath Kind

2005 ◽  
Author(s):  
Haruyuki Watanabe
Keyword(s):  
Corrosion Resistance ◽  
Plating Bath

Electrodeposition and Hardness and Corrosion Resistance Propertie of Ni/Nano-B4C Composite Coatings

2011 ◽  
Vol 399-401 ◽  
pp. 2055-2060
Author(s):  
Ji Bo Jiang ◽  
Wei Dong Liu ◽  
Lei Zhang ◽  
Qing Dong Zhong ◽  
Yi Wang ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Composite Coatings ◽  
Corrosion Property ◽  
Pure Nickel ◽  
Plating Bath ◽  
Tafel Polarization ◽  
Nickel Coatings ◽  
Eis Measurements ◽  
Steel Substrates

Ni–B4C composite coatings on carbon steel substrates with various contents of B4C nano-particulates were prepared by electrodeposition in Ni plating bath containing B4C nano-particulates. Microhardness, Scanning Electron Microscopy (SEM), Tafel polarization and Electrochemical Impedance Spectroscopy (EIS) measurements were used to compare pure nickel coatings and Ni–B4C composite coatings. Pure Ni coating microhardness is lower than that of Ni–B4C coatings and the microhardness of the composite coatings increases with the increase of the content of B4C nano-particulates. The effects of various contents of B4C nano-particulates on the corrosion resistance were investigated and it was found that the best anti–corrosion property of Ni–B4C composite coatings is at 6 g/L B4C in the bath formulation.

Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

2019 ◽  
Vol 49 (1) ◽  
pp. 26-33
Author(s):  
C. Y. Wu ◽  
Y. H. Chen ◽  
Y. K. Tang ◽  
E. J. Lin ◽  
Y. X. Lin ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Chemical Additives ◽  
Plating Bath ◽  
Surface Corrosion

scholarly journals Corrosion Resistance of Electroless Ni-Cu-P Ternary Alloy Coatings in Acidic and Neutral Corrosive Mediums

2010 ◽  
Vol 2010 ◽  
pp. 1-9 ◽  
Author(s):  
Mbouillé Cissé ◽  
Mohamed Abouchane ◽  
Tayeb Anik ◽  
Karima Himm ◽  
Rida Allah Belakhmima ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Steel Substrate ◽  
Corrosion Mechanism ◽  
X Ray Diffraction ◽  
Plating Bath ◽  
Edx Analysis ◽  
Tafel Polarization ◽  
Marginal Improvement ◽  
Electroless Ni

Electroless Ni-Cu-P alloy coatings were deposited on the ordinary steel substrate in an acidic hypophosphite-type plating bath. These coatings were characterized by a scanning electron microscope (SEM) and an X-ray diffraction. The micrograph shows that coating presents a nodular aspect and is relatively homogeneous and very smooth. The EDX analysis shows that the coating contains 12 wt.% of phosphorus element with a predominance of nickel element. In addition, the anticorrosion properties of the Ni-Cu-P coatings in 1 M HCl, 1 M H2SO4, and 3% NaCl solutions were investigated using Tafel polarization curves, electrochemical impedance spectroscopy, and SEM/EDX analysis. The result showed a marginal improvement in corrosion resistance in 3% NaCl solution compared to acidic medium. It also showed that the corrosion mechanism depends on the nature of the solution.

scholarly journals Electrochemical Reduction of Industrial Baths Used for Electropolishing of Stainless Steel

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Paweł Lochyński ◽  
S. Charazińska ◽  
E. Łyczkowska-Widłak ◽  
A. Sikora ◽  
M. Karczewski
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Electrochemical Reduction ◽  
Surface Defects ◽  
Positive Influence ◽  
304 Stainless Steel ◽  
Emission Spectrometry ◽  
Mass Reduction ◽  
Plating Bath ◽  
Slowing Down

Long-term exploitation of industrial electropolishing baths may contribute to the emergence of surface defects and may limit the range of applicable current densities. Due to this, extending the time of use of industrial baths is a major challenge. The application of electrochemical reduction in the process of reduction industrial baths enabled to reduce its contamination and, as a result, to enhance the surface quality of electropolished samples of grade 304 stainless steel. The contamination influence of the electropolishing bath on such parameters of the electropolished samples as roughness, gloss, mass reduction, and corrosion resistance was compared. The conducted tests included reduction of the contaminated industrial bath with use of cathodic reduction and monitoring of bath contamination with use of emission spectrometry ICP-OES. Potentiodynamic tests in 0.5 M chlorine environment with the aim to determine the influence of electrochemical reduction of the plating bath on surface resistance demonstrated that the pitting corrosion resistance of samples electropolished in a bath after reduction was reduced by approximately 0.1 V in comparison with samples electropolished before reduction. The calculations conducted for 24 corrosion resistance measurements demonstrated that differences between the results were significant. Bath reduction leads to improved roughness and gloss, even by approximately 500 GU (gloss units). At the same time, mass reduction decreases even by 13% in comparison with the process conducted in the bath before reduction. This may have a positive influence by slowing down the bath contamination process and, as a result, it reduces negative environmental impact. Another argument that supports the reduction of industrial baths is slowing down the process of cathode contamination during the electropolishing process. In industrial conditions, this may extend the possibility to conduct the process without the need for cathode reduction or replacement.

Effect of Triethanolamine Addition in Alkaline Bath on the Electroplating Behavior, Composition and Corrosion Resistance of Zn-Ni Alloy Coatings

2013 ◽  
Vol 738 ◽  
pp. 87-91 ◽  
Author(s):  
Jin Ming Long ◽  
Xiu Zhang ◽  
He Zhong Pei
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Steel Substrate ◽  
Nickel Content ◽  
Deposition Potential ◽  
Molar Ratio ◽  
Complexing Agents ◽  
Plating Bath ◽  
Ni Alloy ◽  
Alkaline Bath

Zn-Ni alloy coatings were electrodeposited on low carbon steel substrate using a cyanide-free alkaline bath containing tetraethylenepentamine (TEPA) and triethanolamine (TEA) as complexing agents for Ni2+cations. Effect of TEA/Ni2+molar ratio on electrodeposition behavior, micromophology, Ni content and corrosion resistance of coatings were studied by means of SEM/EDS, polarization curve and electrochemical impedance spectroscopy (EIS), respectively. It was found that the deposition potential and elecctrochemical impedance of the cathode sample during the electrodeposition was influenced by the TEA/Ni2+molar ratio (TNmr) in the bath. The deposition potential shifts negatively and the impedance rises with increasing TNmrup to 2. The nickel content in Zn-Ni deposit was varied in a range from 16.81 to 19.04 wt.%. The dependence of cathodic current efficiency and depositing velocity of the coating on TNmrof plating bath were also determined. A fine-grained and smooth-faced coating was obtained at TNmr=2, which exhibited the highest corrosion resistance in 3.5% NaCl environment.

Effect of Acetate on Electrodeposition of Manganese from Chloride Electrolyte with SeO2 Additives

2014 ◽  
Vol 937 ◽  
pp. 193-199
Author(s):  
Wen Po Li ◽  
Xiu Li Zuo ◽  
Jin Hu Liang ◽  
Jia Hong He ◽  
Sheng Tao Zhang
Keyword(s):  
Cyclic Voltammetry ◽  
Corrosion Resistance ◽  
Free Surface ◽  
Sem Analysis ◽  
Plating Bath ◽  
Xrd Pattern ◽  
Chloride Electrolyte ◽  
Manganese Deposits ◽  
Manganese Deposition

This paper deals with manganese electrodeposition from an chloride electrolyte without and with acetate and the resultant deposit properties. The addition of acetate to the plating bath reduces the rate of manganese deposition abserved under cyclic voltammetry and in situ Spectroscopic ellipsometry. The addition of acetate improves the corrosion resistance of the manganese deposits. The XRD pattern obtained for electrodeposited manganese show a pure α-Mn with polycrystalline nature no matter with or without acetate. A uniform and pore free surface was observed under SEM analysis in the two plating baths.

THE CORROSION BEHAVIOR OF ELECTROLESS Ni-P-SiC NANO-COMPOSITE COATING

2008 ◽  
Vol 22 (18n19) ◽  
pp. 3031-3036 ◽  
Author(s):  
FARYAD BIGDELI ◽  
SAEED REZA ALLAHKARAM
Keyword(s):  
Corrosion Resistance ◽  
Electrochemical Impedance ◽  
Composite Coatings ◽  
Electroless Nickel ◽  
Energy Dispersive Spectrum ◽  
X Ray Diffraction ◽  
Plating Bath ◽  
New Class ◽  
Nano Composite Coating ◽  
Electroless Ni

Composite coatings constitute a new class of materials which are mostly used for mechanical and tribological applications. The corrosion resistance of these composite coatings, however, has not been systematically studied and compared. In this study, electroless Ni – P composite coatings are formed on St 37 steel through the addition of nano-scale SiC particles to the plating bath. This work aimed to investigate the corrosion characteristics of electroless nickel composite coatings using electrochemical measurements which include polarization and electrochemical impedance spectroscopy tests. The morphology and structure of the composite coatings were studied by scanning electron microscopy (SEM), energy dispersive spectrum (EDS) and X-ray diffraction (XRD). The results showed that both electroless nickel and electroless nickel composite coatings demonstrated significant improvement of corrosion resistance in salty atmosphere.

scholarly journals Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

RSC Advances ◽  
2021 ◽  
Vol 11 (62) ◽  
pp. 39153-39168
Author(s):  
Bo Wu ◽  
Baizhao Tan ◽  
Guizhen Tan ◽  
Ming Zeng ◽  
Jinyi Luo ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Gold Plating ◽  
Plating Bath ◽  
Cu Substrate ◽  
Black Pad ◽  
Electroless Gold

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

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