Applications for High Thermal Conductivity Graphite Heat Sinks for Fighter Avionics

2004 ◽  
Author(s):  
Scott Newland ◽  
Roland Watts
Keyword(s):  
Thermal Conductivity ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Graphite Heat

Flexible graphene composites with high thermal conductivity as efficient heat sinks in high-power LEDs

2018 ◽  
Vol 52 (2) ◽  
pp. 025103 ◽  
Author(s):  
J Oliva ◽  
A I Mtz-Enriquez ◽  
A I Oliva ◽  
R Ochoa-Valiente ◽  
C R Garcia ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sinks ◽  
High Thermal Conductivity

High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

1995 ◽  
Vol 390 ◽  
Author(s):  
Chris H. Stoessel ◽  
C. Pan ◽  
J. C. Withers ◽  
D. Wallace ◽  
R. O. Loutfy
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Graphite Fiber ◽  
Fiber Reinforced ◽  
Cathode Sputtering ◽  
Large Expansion ◽  
Thermal Conductivities

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.

Synthesis of Copper/Silicon-Carbide Composites in a Thermodynamic Disequilibrium

2015 ◽  
Vol 825-826 ◽  
pp. 189-196 ◽  
Author(s):  
Maren Klement ◽  
Alwin Nagel ◽  
Oliver Lott
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Quantitative Description ◽  
Casting Process ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Structure Property ◽  
Mechanical Loads

Composites with interpenetrating metal-ceramic microstructures (IPC, interpenetrating composites) can be tailored for specific applications, such as high thermal conductivity combined with low thermal expansion, e.g. for heat sinks. Heat sinks are required in power electronic devices or in future fusion reactor technology where extreme conditions and high cyclic thermo-mechanical loads appear. Due to its rigid ceramic backbone IPCs are expected to reveal high thermal stability. Pure silicon carbide exhibits high thermal conductivity, low coefficient of thermal expansion, high corrosion and wear resistance. But it is also known as a very brittle material when mechanical loads are applied. Thus a composite of silicon carbide with ductile and highly conductive copper seems to be a promising new material for a number of applications.This paper reports the synthesis of Cu-SiC composites using a unique high temperature squeeze casting process (HTSC). Microstructural design of SiC-preforms with open porosity and its synthesis progress is reported. Influence of preform properties, temperature, pressure and atmosphere during HTSC were investigated. A qualitative and quantitative description of the microstructure of the composites and their composition allows the creation of structure-property correlations that take effect retroactively to the casting process.

scholarly journals Importance of Melt Flow Direction during Injection Molding on Polymer Heat Sinks’ Cooling Efficiency

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1186
Author(s):  
Michal Guzej ◽  
Martin Zachar ◽  
Jan Kominek ◽  
Petr Kotrbacek ◽  
Robert Brachna
Keyword(s):  
Thermal Conductivity ◽  
Heat Source ◽  
Heat Sink ◽  
Flow Direction ◽  
Conductive Filler ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Cooling Efficiency ◽  
Melt Flow ◽  
Molding Process

Polymers with highly conductive fillers could possibly replace standardly used materials, such as aluminum and copper alloys, for passive cooling purposes. The main problem of the composite polymer-based heat sinks is that their high thermal conductivity is uneven. The orientation of this anisotropy is set according to the position of the highly thermally conductive filler. Its orientation is influenced by the melt flow during the polymer heat sink molding process. This article shows that change of the melt flow inside the mold cavity can improve the overall cooling efficiency of a polymer heat sink, which leads to lower temperatures on the heat source used. Two polymer heat sinks of identical geometries were produced. Their high thermal conductivity was given by the use of graphite flakes as the filler. The only difference between the heat sinks was in the position of the fan gate during their production. Different temperatures of the heat source between the two heat sinks were observed for the same measurement conditions. The measurements were conducted at Heatlab, BUT/Brno.

Preparation of 1D C/C Composites with High Thermal Conductivity

2013 ◽  
Vol 28 (12) ◽  
pp. 1338-1344 ◽  
Author(s):  
Jian-Feng LIN ◽  
Guan-Ming YUAN ◽  
Xuan-Ke LI ◽  
Zhi-Jun DONG ◽  
Jiang ZHANG ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity
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