Enhancement of multichip modules (MCMs) cooling by incorporating micro-heat pipes and other high thermal conductivity materials into microchannel heat sinks

2002 ◽  
Author(s):  
M.J. Marongiu ◽  
B. Kusha ◽  
G.S. Fallon ◽  
A.A. Watwe
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipes ◽  
Heat Sinks ◽  
High Thermal Conductivity ◽  
Multichip Modules ◽  
Microchannel Heat Sinks ◽  
Micro Heat Pipes

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson
Keyword(s):  
Thermal Conductivity ◽  
Steady State ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Temperature Gradients ◽  
Bottom Surface ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.

Flexible graphene composites with high thermal conductivity as efficient heat sinks in high-power LEDs

2018 ◽  
Vol 52 (2) ◽  
pp. 025103 ◽  
Author(s):  
J Oliva ◽  
A I Mtz-Enriquez ◽  
A I Oliva ◽  
R Ochoa-Valiente ◽  
C R Garcia ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Heat Sinks ◽  
High Thermal Conductivity

Evaporation, Condensation, and Flow in an Idealized Micro Heat Pipe

2002 ◽  
Author(s):  
Jin Zhang ◽  
Harris Wong
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Rigorous Analysis ◽  
Evaporation And Condensation ◽  
Micro Heat Pipe ◽  
Complicated Geometry ◽  
Micro Heat Pipes

Micro heat pipes have been used in cooling micro electronic components. However their effective thermal conductivity is low compared with that of conventional heat pipes. Due to the complexity of the coupled heat and mass transport, and to the complicated three-dimensional bubble geometry inside micro heat pipes, there is a lack of rigorous analysis. As a result, the relatively low effective thermal conductivity remains unexplained. We have conceptualized an idealized micro heat pipe that eliminates the complicated geometry, but retains the essential physics. Given the simplified geometry, many effects can be studied, such as thermocapillary flow, and evaporation and condensation physics. In this talk, we will present the flow field induced by evaporation.

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

On the Cooling of Electronics With Nanofluids

2011 ◽  
Vol 133 (5) ◽  
Author(s):  
W. Escher ◽  
T. Brunschwiler ◽  
N. Shalkevich ◽  
A. Shalkevich ◽  
T. Burgi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermophysical Properties ◽  
Heat Sink ◽  
Relative Viscosity ◽  
Volumetric Flow Rate ◽  
Silica Nanoparticle ◽  
Particle Morphology ◽  
Heat Sinks ◽  
Conductivity Enhancement ◽  
Microchannel Heat Sinks

Nanofluids have been proposed to improve the performance of microchannel heat sinks. In this paper, we present a systematic characterization of aqueous silica nanoparticle suspensions with concentrations up to 31 vol %. We determined the particle morphology by transmission electron microscope imaging and its dispersion status by dynamic light scattering measurements. The thermophysical properties of the fluids, namely, their specific heat, density, thermal conductivity, and dynamic viscosity were experimentally measured. We fabricated microchannel heat sinks with three different channel widths and characterized their thermal performance as a function of volumetric flow rate for silica nanofluids at concentrations by volume of 0%, 5%, 16%, and 31%. The Nusselt number was extracted from the experimental results and compared with the theoretical predictions considering the change of fluids bulk properties. We demonstrated a deviation of less than 10% between the experiments and the predictions. Hence, standard correlations can be used to estimate the convective heat transfer of nanofluids. In addition, we applied a one-dimensional model of the heat sink, validated by the experiments. We predicted the potential of nanofluids to increase the performance of microchannel heat sinks. To this end, we varied the individual thermophysical properties of the coolant and studied their impact on the heat sink performance. We demonstrated that the relative thermal conductivity enhancement must be larger than the relative viscosity increase in order to gain a sizeable performance benefit. Furthermore, we showed that it would be preferable to increase the volumetric heat capacity of the fluid instead of increasing its thermal conductivity.

On the Use of Micro Heat Pipes as an Integral Part of Semiconductor Devices

1992 ◽  
Vol 114 (4) ◽  
pp. 436-442 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson ◽  
M. H. Weichold
Keyword(s):  
Numerical Model ◽  
Three Dimensional ◽  
Internal Heat ◽  
Heat Pipes ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Physical Parameters ◽  
Chip Temperature ◽  
Array Density ◽  
Micro Heat Pipes

A transient three-dimensional numerical model was developed to determine the potential advantages of constructing an array of very small (100 μm diameter) heat pipes as an integral part of semiconductor chips. Because of the high effective thermal conductivity, this array of heat pipes functions as a highly efficient heat spreader. The numerical model presented here, when given the physical parameters of the chip and the locations and magnitude of the internal heat generation, is capable of predicting the time dependent temperature distribution, localized heat flux, and temperature gradients occurring within the chip. The results of this modeling effort indicate that significant reductions in the maximum chip temperature, thermal gradients and localized heat fluxes can be obtained through the incorporation of arrays of micro heat pipes. Utilizing heat sinks located on the edges of the chip perpendicular to the axis of the heat pipes and an optimized array density of 1.35 percent, reductions in the maximum chip temperature of up to 40 percent were achieved.

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