A Modular Numerical Simulation Tool Predicting Catalytic Converter Light-Off by Improved Modeling of Thermal Management and Conversion Characteristics

2001 ◽  
Author(s):  
S. Büchner ◽  
S. Santos Lardies ◽  
A. Degen ◽  
A. Donnerstag ◽  
W. Held
Keyword(s):  
Numerical Simulation ◽  
Thermal Management ◽  
Catalytic Converter ◽  
Simulation Tool

scholarly journals Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

2004 ◽  
Vol 812 ◽  
Author(s):  
Z. -S. Choi ◽  
C. L. Gan ◽  
F. Wei ◽  
C. V. Thompson ◽  
J. H. Lee ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Failure Mechanisms ◽  
Simulation Tool ◽  
Void Size ◽  
Dual Damascene ◽  
Preferential Nucleation ◽  
Failure Correlation ◽  
Void Volumes ◽  
Damascene Interconnects ◽  
Critical Void

AbstractThe median-times-to-failure (t50's) for straight dual-damascene via-terminated copper interconnect structures, tested under the same conditions, depend on whether the vias connect down to underlaying leads (metal 2, M2, or via-below structures) or connect up to overlaying leads (metal 1, M1, or via-above structures). Experimental results for a variety of line lengths, widths, and numbers of vias show higher t50's for M2 structures than for analogous M1 structures. It has been shown that despite this asymmetry in lifetimes, the electromigration drift velocity is the same for these two types of structures, suggesting that fatal void volumes are different in these two cases. A numerical simulation tool based on the Korhonen model has been developed and used to simulate the conditions for void growth and correlate fatal void sizes with lifetimes. These simulations suggest that the average fatal void size for M2 structures is more than twice the size of that of M1 structures. This result supports an earlier suggestion that preferential nucleation at the Cu/Si3N4 interface in both M1 and M2 structures leads to different fatal void sizes, because larger voids are required to span the line thickness in M2 structures while smaller voids below the base of vias can cause failures in M1 structures. However, it is also found that the fatal void sizes corresponding to the shortest-times-to-failure (STTF's) are similar for M1 and M2, suggesting that the voids that lead to the shortest lifetimes occur at or in the vias in both cases, where a void need only span the via to cause failure. Correlation of lifetimes and critical void volumes provides a useful tool for distinguishing failure mechanisms.

scholarly journals Three-Method Hybrid Numerical Simulation for Surface-Plasmon-Enhanced GaInN-Based Light-Emitting Diodes with Metal-Embedded Nanostructures

2021 ◽  
Vol 9 ◽  
Author(s):  
Ryoya Hiramatsu ◽  
Ryo Takahashi ◽  
Ryoto Fujiki ◽  
Keisuke Hozo ◽  
Kanato Sawai ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Light Emitting Diodes ◽  
Simulation Tool ◽  
Wave Analysis ◽  
Light Emitting ◽  
Rigorous Coupled Wave Analysis ◽  
Physical Background ◽  
Simulation Results ◽  
Rigorous Coupled Wave ◽  
Difference Time

In this paper, a hybrid numerical simulation tool is introduced and performed for GaInN-based light-emitting diodes (LEDs) with metal-embedded nanostructure to theoretically predict external quantum efficiency (EQE), which composed of finite-difference time-domain, rigorous coupled wave analysis, and ray tracing. The advantage is that the proposed method provides results supported by sufficient physical background within a reasonable calculation time. From the simulation results, the EQE of LED with Ag-nanoparticles embedded nanostructure is expected to be enhanced by as high as ∼1.6 times the conventional LED device in theory.

Microscale Thermoplastic Forming of Bulk Metallic Glasses: Numerical Simulations and Experiments

2008 ◽  
Author(s):  
David L. Henann ◽  
Lallit Anand
Keyword(s):  
Numerical Simulation ◽  
Metallic Glasses ◽  
Bulk Metallic Glasses ◽  
Processing Parameters ◽  
Hot Embossing ◽  
Simulation Tool ◽  
Processing Conditions ◽  
Trial And Error ◽  
Physical Experiments ◽  
Thermoplastic Forming

An extremely promising microscale processing method for bulk metallic glasses called thermoplastic forming has emerged in recent years. However, most of the recent experimental thermoplastic forming studies have been conducted by trial-and-error. In this paper, the large-deformation constitutive theory of Henann and Anand [1] is used as a numerical simulation tool for the design of micro-hot-embossing processes. This numerical simulation capability is used to determine appropriate processing parameters in order to carry out several successful micron-scale hot-embossing operation on the metallic glass Zr41.2Ti13.8Cu12.5Ni10Be22.5 (Vitreloy-1). By carrying out the corresponding physical experiments, it is demonstrated that microscale features in Vitreloy-1 may be accurately replicated under the processing conditions determined by use of the numerical simulation capability.

scholarly journals Numerical simulation of the effect of material catalytic converter on gas emission

2018 ◽  
Vol 204 ◽  
pp. 04018
Author(s):  
Suheni ◽  
Rudy Sunoko ◽  
Slamet Wahyudi ◽  
Amin S Leksono
Keyword(s):  
Numerical Simulation ◽  
Mass Fraction ◽  
Thermal Condition ◽  
Catalytic Converter ◽  
Human Life ◽  
High Mass ◽  
Gas Emission ◽  
Rest Time ◽  
Fluent Software ◽  
Co Gas

The disposal of gas emission from vehicle is the biggest contributor to the environmental pollution which generates most carbon monoxide, hydrocarbon, and lead (Pb=Plumbum). Those substance particulates are pollutants and harmful for both the environment and human life. One of the innovations that can reduce the pollutive particulates is to reduce CO gas by assembling a catalytic converter are displayed. In order to find out the effect of catalytic converter absorption toward (CO) gas particulate, varied with various materials in an environmentally friendly catalytic converter, a simulation using fluent software is carried out. From the simulation, it is seen a significant thermal condition and CO mass fraction absorption from various different materials, by applying mass fraction of CO=0.04;N2=0.8796; and O2=0.12, the decrease of high mass fraction (decrease of CO=0.004 mass fraction) occurs at the channel centre area due to the mass fraction of various materials that moves away from the center with a longer rest time (high conversion) at the surrounding channel.

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