scholarly journals Mechanical Properties of Micro- and Nanostructured Copper Films

2013 ◽  
Vol 01 (05) ◽  
pp. 7-10
Author(s):  
N. Kosarev ◽  
M. Khazin ◽  
R. Apakashev ◽  
N. Valiev
Keyword(s):  
Mechanical Properties ◽  
Copper Films ◽  
Nanostructured Copper

Measurement and interpretation of stress in copper films as a function of thermal history

1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal History ◽  
Copper Films ◽  
Thermally Induced ◽  
Aluminum Films ◽  
Interconnection Material ◽  
Interconnect Systems

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.

Influence of a Capping Layer on the Mechanical Properties of Copper Films

1994 ◽  
Vol 356 ◽  
Author(s):  
R.-M. Keller ◽  
S. Bader ◽  
R. P. Vinci ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Film Thickness ◽  
Grain Growth ◽  
Low Temperatures ◽  
Bauschinger Effect ◽  
Diffusional Creep ◽  
Copper Films ◽  
Cu Films ◽  
Heating And Cooling ◽  
Cooling Stress

AbstractThe substrate curvature technique was employed to study the mechanical properties of 0.6 μm and 1.0 μm Cu films capped with a 50 nm thick Si3N4 layer and to compare them with the mechanical properties of uncapped Cu films. The microstructures of these films were also investigated. Grain growth, diffusional creep and dislocation processes are impeded by the cap layer. This is evident in the form of high stresses at high temperatures on heating and at low temperatures on cooling. At intermediate temperatures on heating and cooling, stress plateaus a relatively low stresses exist. This can be explained by the so-called Bauschinger effect. A film thickness dependence of the stresses in the film could not be observed for capped Cu films.

Mechanical Properties of Copper Films

1970 ◽  
Vol 41 (1) ◽  
pp. 402-406 ◽  
Author(s):  
H. Leidheiser ◽  
Billy W. Sloope
Keyword(s):  
Mechanical Properties ◽  
Copper Films

scholarly journals Study of the structure, physico-mechanical properties and thermal stability of nanostructured copper and bronze processed by DCAP

2013 ◽  
Vol 3 (2) ◽  
pp. 150-154 ◽  
Author(s):  
I. V. Khomskaya ◽  
V. I. Zel'dovich ◽  
A. V. Makarov ◽  
A. E. Heyfets ◽  
N. Y. Frolova ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Thermal Stability Of ◽  
Nanostructured Copper
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