scholarly journals A Generic MEMS Fabrication Process Based on a Thermal Budget Approach

2016 ◽  
Vol 06 (02) ◽  
pp. 97-107
Author(s):  
Carlos Ramón Báez Álvarez ◽  
Álvarez, Mónico Linares Aranda ◽  
Alfonso Torres Jácome ◽  
Mario Moreno Moreno ◽  
Joel Molina Reyes ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Thermal Budget ◽  
Mems Fabrication

scholarly journals A modular and generic monolithic integrated MEMS fabrication process

2017 ◽  
Vol 30 (3) ◽  
pp. 30-39
Author(s):  
Mónico Linares Aranda ◽  
W. Calleja Arriaga ◽  
A. Torres Jacome ◽  
C.R. Báez Álvarez
Keyword(s):  
Mechanical Test ◽  
Electronic Devices ◽  
Fabrication Process ◽  
Test Chip ◽  
Optimal Point ◽  
Thermal Budget ◽  
Mems Fabrication ◽  
Complete Set ◽  
Mems Process ◽  
Manufacturing Stage

A modular and generic, monolithic integrated MEMS fabrication process is presented to integrate microelectronics (CMOS) with mechanical microstructures (MEMS). The proposed monolithic integrated fabrication process is designed using an intra-CMOS approach (to fabricate the mechanical microstructures into trenches without the need of planarization techniques) and a CMOS module (to fabricate the electronic devices) with a 3 ?m length as minimum feature. The microstructures module is made up to three polysilicon layers, and aluminum as electrical interconnecting material. From simulation results, using the SILVACO® suite (Athena and Atlas frameworks), no significant degradation on the CMOS performance devices was observed after MEMS manufacturing stage; however, the thermal budget of the modules plays a crucial role, because it set the conditions for obtaining the complete set of devices fabricated near their optimal point. Finally, to evaluate and to support the development of the proposed integrated MEMS process, a modular test chip that includes electrical test structures, mechanical test structures, interconnection reliability test structures and functional micro-actuators, was also designed.

Piezoelectric T-Beam Microactuators

2008 ◽  
Author(s):  
Hareesh K. R. Kommepalli ◽  
Andrew D. Hirsh ◽  
Christopher D. Rahn ◽  
Srinivas A. Tadigadapa
Keyword(s):  
Cross Section ◽  
Fabrication Process ◽  
Mems Fabrication ◽  
Out Of Plane ◽  
Cantilevered Beam ◽  
Piezoelectric Mems ◽  
The Cross ◽  
T Beam ◽  
Cross Section Geometry

This paper introduces a novel T-beam actuator fabricated by a piezoelectric MEMS fabrication process. ICP-RIE etching from the front and back of a bulk PZT chip is used to produce stair stepped structures through the thickness with complex inplane shapes. Masked electrode deposition creates active and passive regions in the PZT structure. With a T-shaped crosssection, and bottom and top flange and web electrodes, a cantilevered beam can bend in-plane and out-of-plane with bimorph actuation in both directions. One of these T-beam actuators is fabricated and experimentally tested. An experimentally validated model predicts that the cross-section geometry can be optimized to produce higher displacement and blocking force.

MEMS fabrication process management environment

2005 ◽  
Author(s):  
Jens Popp ◽  
Thilo Schmidt ◽  
Andreas Wagener ◽  
Kai Hahn
Keyword(s):  
Process Management ◽  
Fabrication Process ◽  
Mems Fabrication

Development of a novel thermal switch through CMOS MEMS fabrication process

2011 ◽  
Author(s):  
You-Liang Lai ◽  
Lei-Chun Chou ◽  
Ying-Zong Juang ◽  
Hann-Huei Tsai ◽  
Sheng-Chieh Huang ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Thermal Switch ◽  
Mems Fabrication ◽  
Cmos Mems

Triangular Prism and Slit Electrode Pair for ECF Jetting Fabricated by Thick Micromold and Electroforming as Micro Hydraulic Pressure Source for Soft Microrobots

2016 ◽  
Vol 10 (4) ◽  
pp. 470-478 ◽  
Author(s):  
Joon-Wan Kim ◽  
◽  
Thanh V. X. Nguyen ◽  
Kazuya Edamura ◽  
Shinichi Yokota ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Dielectric Fluid ◽  
Electrode Pair ◽  
Hydraulic Pressure ◽  
Triangular Prism ◽  
Maximum Output ◽  
Output Pressure ◽  
Mems Fabrication ◽  
Micromechanical Systems ◽  
Air Compressors

In this paper, we propose a triangular prism and slit electrode pair (TPSE) and its micromechanical systems (MEMS) fabrication process for a novel micropump using electro-conjugate fluid (ECF), which is based on a thick photoresist (KMPR) micromold (≥ 500 μm) and nickel electroforming. ECF is a kind of functional and dielectric fluid. The strong and active jet flow of an ECF is generated between two electrodes surrounded by the ECF when a high direct-current voltage is applied to the electrode pair. The micropumps generated by the ECF jetting can be used as micro hydraulic pressure sources for soft microrobots. By substituting these ECF micropumps for bulky air compressors or hydraulic pumps utilized in soft robots, we can realize advanced soft microrobots in which the driving sources are embedded. An MEMS-based TPSE for an ECF micropump was successfully fabricated by using the proposed MEMS fabrication process. The maximum output pressure without a flow and the flow rate without a load were 24.6 kPa and 27.5 mm3/s, respectively, at an applied voltage of 2 kV. The experimental results show that the MEMS-fabricated TPSE is a good candidate for electrode-type ECF micropumps utilized in various applications of soft microrobots whose pressure sources are embedded inside.

Optimization of MEMS fabrication process design by virtual experiments

2006 ◽  
Author(s):  
T. Schmidt ◽  
K. Hahn ◽  
T. Binder ◽  
J. Popp ◽  
A. Wagener ◽  
...  
Keyword(s):  
Process Design ◽  
Fabrication Process ◽  
Virtual Experiments ◽  
Mems Fabrication
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